Abstract: A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.

Abstract: A semiconductor structure includes a first gate structure, a second gate structure coupled to the first gate structure, a source region, a first drain region, and a second drain region. The source region is surrounded by the first gate structure and the second gate structure. The first drain region is separated from the source region by the first gate structure. The second drain region is separated from the source region by the second gat structure. A shape of the first drain region and a shape of the second drain region are different from each other from a plan view.

Abstract: A micro-light-emitting diode (microLED) display panel includes a display area divided into a plurality of blocks; a plurality of drivers that drive microLEDs of the blocks respectively; and at least one timing controller that controls the drivers. In each block, anodes of microLEDs in a same row are connected to a corresponding data line, and cathodes of microLEDs in a same column are connected to a corresponding common line.

Abstract: A micro-light-emitting diode (microLED) display panel includes a plurality of microLEDs arranged in rows and columns. Anodes of microLEDs in a same row are connected to a corresponding data line, and cathodes of pixels in a same column are connected to a corresponding group of common lines, each of which is connected to cathodes of microLEDs of different colors.

Abstract: A light-emitting diode (LED) display includes a top-emission LED that emits light upward; a bottom-emission LED that emits light downward; and a spacer disposed between the top-emission LED and the bottom-emission LED, thereby providing a dual-sided display.

Abstract: A micro-light-emitting diode (microLED) display panel includes a display area divided into a plurality of blocks; a plurality of drivers that drive microLEDs of the blocks respectively; and at least one timing controller that controls the drivers. In each block, anodes of microLEDs in a same row are connected to a corresponding data line, and cathodes of microLEDs in a same column are connected to a corresponding common line.

Abstract: A micro-light-emitting diode (microLED) display panel includes microLEDs disposed on a display area, which is divided into a plurality of blocks; drivers respectively disposed on the blocks; and probe pads disposed within each block, the probe pads being electrically connected to corresponding microLEDs via corresponding electric wires. The probe pads and the electric wires of a corresponding block are disposed locally and confined to the corresponding block, and are not connected elsewhere beyond the corresponding block.

Abstract: A micro-light-emitting diode (microLED) display panel includes a substrate; a plurality of microLEDs disposed and arranged in rows and columns on the substrate; a driver disposed on the substrate; a plurality of first blocking walls respectively disposed between rows of the microLEDs; and a plurality of second blocking walls respectively disposed between the microLEDs of the same row.

Abstract: A bottom-emission light-emitting diode (LED) display includes a transparent substrate, a plurality of LEDs bonded on the substrate, a packaging layer formed on the substrate to cover the LEDs, and a reflecting layer formed on the packaging layer to reflect light emitted by the plurality of LEDs. The reflecting layer has a non-smooth shape or the packaging layer has different refractivities.

Abstract: A bonding method of a semiconductor device is disclosed. The method includes steps of forming a plurality of holes on two bonding parts of a main substrate, respectively; disposing a semiconductor device on the main substrate, and aligning the two bonding parts with two conduction parts of the semiconductor device; aligning a laser to the conduction parts and operating the laser to emit a laser beam from a lower part of the main substrate, wherein the laser beam passes through the holes of the bonding part to strike on the conduction part, so as to melt each conduction part to bond with the bonding part. With configuration of the holes, the conduction parts and the bonding part can be smoothly bonded by using laser, so as to achieve the purpose of transferring the semiconductor device.

Abstract: A method of bonding a light-emitting diode (LED) with a substrate includes providing a LED disposed on a bottom surface of a LED substrate; forming a first isolating layer entirely on a substrate; forming a second isolating layer on the first isolating layer within a first area corresponding to an N-type contact pad of the LED; forming a first conductive layer on the second isolating layer within the first area; forming a second conductive layer on the first isolating layer within a second area corresponding to a P-type contact pad of the LED; and bonding the LED to the substrate by connecting the N-type contact pad to the first conductive layer within the first area, and connecting the P-type contact pad to the second conductive layer within the second area.

Abstract: A method of forming a micro light-emitting diode (microLED) display includes providing a substrate with a plurality of microLEDs and at least one integrated circuit disposed thereon; and forming a planarization layer to cover the microLEDs and the at least one integrated circuit. The planarization layer acts as both a light blocking layer and a corrosion-resistant layer.

Abstract: A touch device including a plurality of touch electrodes which are electrically separated is provided. Each touch electrode includes a plurality of first curved patterns and a plurality of conductive lines. The first curved patterns are parallel to each other. A first pitch is between two adjacent first curved patterns. Each conductive line is connected between two adjacent first curved patterns. The conductive lines are arranged in a plurality of second curved patterns. The first curved patterns intersect the second curved patterns. In this way, the touch device can have preferable touch and visual effects.

Abstract: A test method of an in-cell touch display device includes providing a plurality of first test signals and a plurality of second test signals to the first connection pads and the second connection pads of the in-cell touch display device, respectively. Each of the first connection pads is electrically connected to a corresponding data line of the in-cell touch display device, and each of the second connection pads is electrically connected to a corresponding touch electrode of the in-cell touch display device, and the in-cell touch display device is tested after the first and second test signals are provided to the first and second connection pads.

Abstract: A bonding method of a semiconductor device is disclosed. The method includes steps of forming a plurality of holes on two bonding parts of a main substrate, respectively; disposing a semiconductor device on the main substrate, and aligning the two bonding parts with two conduction parts of the semiconductor device; aligning a laser to the conduction parts and operating the laser to emit a laser beam from a lower part of the main substrate, wherein the laser beam passes through the holes of the bonding part to strike on the conduction part, so as to melt each conduction part to bond with the bonding part. With configuration of the holes, the conduction parts and the bonding part can be smoothly bonded by using laser, so as to achieve the purpose of transferring the semiconductor device.

Abstract: A touch display apparatus including a display panel and multiple touch electrodes disposed on the display panel is provided. The display panel has a plurality of pixel regions. Each of the pixel regions is arranged with a first pixel pitch Ppx along a first direction. Each of the pixel regions is arranged with a second pixel pitch Ppy along a second direction. Each touch electrode has a plurality of touch patterns. Each of the touch patterns is arranged with a first touch pitch Ptx along the first direction. Each of the touch patterns includes a plurality of bent segments connected to each other. Each of the bent segments is arranged with a second touch pitch Pty along the second direction. The first pixel pitch Ppx, the second pixel pitch Ppy, the first touch pitch Ptx and the second touch pitch Pty satisfy at least one of the following equations (1) and (2): 30 ? % ? ? P tx - P px ? P px ? 50 ? % , equation ? ? ( 1 ) 3 ? P ty P py ? 12.

Abstract: A touch device including a plurality of touch electrodes which are electrically separated is provided. Each touch electrode includes a plurality of first curved patterns and a plurality of conductive lines. The first curved patterns are parallel to each other. A first pitch is between two adjacent first curved patterns. Each conductive line is connected between two adjacent first curved patterns. The conductive lines are arranged in a plurality of second curved patterns. The first curved patterns intersect the second curved patterns. In this way, the touch device can have preferable touch and visual effects.

Abstract: An in-cell touch display device includes a first substrate, a second substrate, a plurality of scan lines, a plurality of data lines, a plurality of touch electrodes and a plurality of connection pads. The second substrate is disposed opposite to the first substrate. The scan lines and the data lines are disposed on the first substrate. The touch electrodes are disposed between the first substrate and the second substrate. The connection pads are disposed on the first substrate, and the connection pads are electrically connected to one of the data lines or one of the touch electrodes. Each of at least some of the connection pads has a bonding part and an extension part, and an area of the bonding part is smaller than an area of the extension part.

Abstract: A touch-sensing liquid crystal panel and a fabrication method thereof are provided. The touch-sensing liquid crystal panel includes a color filter substrate and a transistor substrate. In the fabrication method, at first, a first glass substrate is provided. Thereafter, a sensing matrix is formed on a first surface of the first glass substrate at a baking temperature. The sensing matrix is formed from indium tin oxide (ITO), and a sheet resistance of the sensing matrix is equal to or less than 30 ohm/square. Then, color filters and a common electrode are disposed on a second surface of the first glass substrate to form a color filter substrate, wherein the second surface is opposite to the first surface. Thereafter, the transistor substrate is provided and combined with the color filter substrate. Thereafter, a slimming process is performed to slim a second glass substrate of the transistor substrate.

Abstract: An anti-interference touch sensing structure includes a first substrate, a plurality of touch sensing units and at least a first anti-interference spot. The touch sensing units are coplanarly disposed on the first substrate, and a first interval region is formed between the adjacent touch sensing units. The first anti-interference spot is disposed within the first interval region.