Abstract: The present disclosure provides a dummy die with improved thermal conductivity and warpage control. The dummy die includes an adjustment layer formed over a semiconductor substrate. The adjustment layer has a thermal conductivity in a range between about 30 W/mK and about 100 W/mK. The adjustment layer may include silicon nitride or silicon carbide.

Abstract: An electronic device includes a pixel circuit, a data line and two control signal lines. The pixel circuit includes a first sub-pixel circuit and a second sub-pixel circuit, in which a light color of the first sub-pixel circuit is different from a light color of the second sub-pixel circuit. The data line is electrically connected with the first sub-pixel circuit and the second sub-pixel circuit. The two control signal lines are respectively a first control signal line and a second control signal line. The first control signal line is electrically connected with the first sub-pixel circuit for controlling a light-emitting time of the first sub-pixel circuit, and the second control signal line is electrically connected with the second sub-pixel circuit for controlling a light-emitting time of the second sub-pixel circuit.

Abstract: A photographic system for photographing a warm-blooded animal in a background is provided, including an infrared sensor, a host, and a camera module. The infrared sensor is configured to identify the position of the warm-blooded animal in the background, and generate position data according to the position. The host is coupled to the infrared sensor, and configured to receive the position data and generate at least one parameter according to the position data. The camera module is coupled to the host, and includes a camera and a controller. The controller is configured to receive the parameter and adjust the photographing direction of the camera according to the parameter.

Abstract: An electronic device includes a signal readout line and a sensor component electrically connected to the signal readout line. The sensor component includes a pixel sensor and a sensor pad. The pixel sensor includes a first transistor, a first capacitor and a second transistor. The first transistor includes a first terminal, a second terminal, and a first control terminal. The first capacitor is electrically connected to the first control terminal and the second terminal. The second transistor includes a third terminal, a fourth terminal and a second control terminal. The fourth terminal is electrically connected to the signal readout line. The sensor pad is electrically connected to the second terminal. The pixel sensor includes a third transistor including a fifth terminal, a sixth terminal and a third control terminal. The third control terminal is electrically connected to the second terminal. The sixth terminal is electrically connected to the third terminal.

Abstract: An electronic device includes a panel. The panel includes a plurality of scan electrodes, a plurality of data electrodes and a cholesteric liquid crystal layer. The plurality of data electrodes and the plurality of scan electrodes are intersected with each other to define a plurality of pixels. The cholesteric liquid crystal layer is disposed between the plurality of scan electrodes and the plurality of data electrodes. In a writing mode, a first voltage difference is applied to at least one pixel disposed in a writing area, and a second voltage difference is applied to at least a portion of the other pixels disposed in a non-writing area. In an erasing mode, a third voltage difference is applied to at least one pixel disposed in an erasing area, where the first voltage difference is different from the second voltage difference, and the first voltage difference is different from the third voltage difference.

Abstract: An electronic device with a plurality of panels is provided. The electronic device also has a plurality of scan line driving circuits that correspond to the panels in order to drive the panels. The electronic device also has a controller that is configured to control the scan line driving circuits. Each panel includes a plurality of scan lines. Prior to image refreshing, the controller controls the scan line driving circuits to reset the panels. The controller performs image refreshing by controlling each scan line driving circuit to scan the scan lines of its corresponding panel in a jumping mode scanning procedure.

Abstract: A head mounted device and an operating method for the head mounted device are provided. The head mounted device includes a display unit, a first sensing device and a second sensing device. The display unit displays an image. The first sensing device detects whether there is an object causing harm to the user within a specific range. The second sensing device captures an object image of the object, so that the display unit displays the object image.

Abstract: An electronic device includes a first insulating layer, a first conductive portion, a second conductive portion, a transistor, and an electronic unit. The first insulating layer has a first opening penetrating the first insulating layer along a first direction. The first conductive portion is disposed in the first opening. The second conductive portion is electrically connected to the first conductive portion. The transistor is electrically connected to the second conductive portion. The electronic unit is electrically connected to the first conductive portion. In a cross-sectional view of the electronic device, the electronic unit and the second conductive portion are disposed on two opposite sides of the first insulating layer respectively, the first conductive portion has a first length along a second direction perpendicular to the first direction, the second conductive portion has a second length along the second direction, and the first length is different from the second length.

Abstract: A method includes forming a conductive pad over a substrate, forming a multi-layer passivation structure on the conducive pad, patterning a top portion of the multi-layer passivation structure to form a first opening, forming a mask film on sidewall surfaces of the patterned top portion of the multi-layer passivation structure, after the forming of the mask film, performing a first etching process to remove a portion of the multi-layer passivation structure directly under the first opening to form a second opening, after the performing of the first etching process, selectively removing the mask film, performing a second etching process to remove a portion of the multi-layer passivation structure directly under the second opening, thereby forming a third opening exposing the conductive pad, and forming a bonding structure in the third opening, where an etchant of the second etching process is different than an etchant of the first etching process.

Abstract: An electronic device includes a first insulating layer, a first conductive portion, a second conductive portion, a transistor, and an electronic unit. The first insulating layer has a first opening penetrating the first insulating layer along a first direction. The first conductive portion is disposed in the first opening. The second conductive portion is electrically connected to the first conductive portion. The transistor is electrically connected to the second conductive portion. The electronic unit is electrically connected to the first conductive portion. In a cross-sectional view of the electronic device, the electronic unit and the second conductive portion are disposed on two opposite sides of the first insulating layer respectively, the first conductive portion has a first length along a second direction perpendicular to the first direction, the second conductive portion has a second length along the second direction, and the first length is different from the second length.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: A touch display device is provided in this disclosure. The touch display device includes a substrate, a first conductive layer, a second conductive layer, a stacked structure, an inorganic light emitting unit, and a touch sensing circuit. The first conductive layer is disposed on the substrate. The first conductive layer includes a gate electrode. The second conductive layer is disposed on the first conductive layer. The second conductive layer includes a source electrode and a drain electrode. The stacked structure is disposed on the substrate. The stacked structure includes a conductive channel and a sensing electrode. The inorganic light emitting unit is disposed on the stacked structure. The inorganic light emitting unit is electrically connected with the drain electrode via the conductive channel. The touch sensing circuit is electrically connected with the sensing electrode.

Abstract: Sensing pixels each store a sensing voltage level. A method for driving the plurality of sensing pixels includes providing a plurality of readout scan signals to the plurality of sensing pixels, and providing a plurality of reset scan signals to the plurality of sensing pixels. One of the plurality of readout scan signals enables one of the plurality of sensing pixels to output the sensing voltage level stored in the one of the plurality of sensing pixels. One of plurality of reset scan signals resets the sensing voltage level stored in one of the plurality of sensing pixels. An nth reset scan signal of the plurality of reset scan signals is started behind an nth readout scan signal of the plurality of readout scan signals in time domain.

Abstract: An electronic device includes a substrate, a plurality of first pads, a plurality of sensing units and a plurality of test pads. The first pads are disposed on the substrate, the sensing units are disposed on the substrate and electrically connected to the first pads, and the test pads are disposed on the substrate and electrically connected to the sensing units.

Abstract: A semiconductor process system includes a process chamber. The process chamber includes a wafer support configured to support a wafer. The system includes a bell jar configured to be positioned over the wafer during a semiconductor process. The interior surface of the bell jar is coated with a rough coating. The rough coating can include zirconium.

Abstract: Sensing pixels each store a sensing voltage level. A method for driving the plurality of sensing pixels includes providing a plurality of readout scan signals to the plurality of sensing pixels, and providing a plurality of reset scan signals to the plurality of sensing pixels. One of the plurality of readout scan signals enables one of the plurality of sensing pixels to output the sensing voltage level stored in the one of the plurality of sensing pixels. One of plurality of reset scan signals resets the sensing voltage level stored in one of the plurality of sensing pixels. An nth reset scan signal of the plurality of reset scan signals is started behind an nth readout scan signal of the plurality of readout scan signals in time domain.

Abstract: An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.

Abstract: Sensing pixels each store a sensing voltage level. A method for driving the plurality of sensing pixels includes providing a plurality of readout scan signals to the plurality of sensing pixels, and providing a plurality of reset scan signals to the plurality of sensing pixels. One of the plurality of readout scan signals enables one of the plurality of sensing pixels to output the sensing voltage level stored in the one of the plurality of sensing pixels. One of plurality of reset scan signals resets the sensing voltage level stored in one of the plurality of sensing pixels. One of the plurality of reset scan signals is generated by converting one of the plurality of readout scan signals with a level shift circuit or one of the plurality of readout scan signals is generated by converting one of the plurality of reset scan signals with a level shift circuit.

Abstract: An operation method of a semiconductor removing apparatus includes moving a semiconductor structure to a stage, wherein the semiconductor structure includes a lower substrate, a cap, and a micro electro mechanical system (MEMS) structure between the lower substrate and the cap, and the cap has a diced portion; pulling, by a clamp assembly, a tape of a tape roll from a first side of the stage to a second side of the stage opposite to the first side, such that the tape is attached to the cap of the semiconductor structure; and pulling, by the clamp assembly, the tape of the tape roll from the second side of the stage back to the first side of the stage, such that the diced portion of the cap separates from the semiconductor structure.

Abstract: An electronic device includes a signal readout line and a sensor component electrically connected to the signal readout line. The sensor component includes a pixel sensor and a sensor pad. The pixel sensor includes a first transistor, a first capacitor and a second transistor. The first transistor includes a first terminal, a second terminal, and a first control terminal, wherein the first capacitor is electrically connected to the first control terminal and the second terminal. The second transistor includes a third terminal, a fourth terminal and a second control terminal, wherein the fourth terminal is electrically connected to the signal readout line. The sensor pad is electrically connected to the second terminal.