Abstract: A light-emitting diode (LED) light source module is described, comprising: a heat conduction substrate, wherein a surface of the heat conduction substrate includes a plurality of recesses; a plurality of light-emitting diode chips respectively disposed in the recesses; an insulation layer disposed on the surface of the heat conduction substrate outside of the recesses; an electric conduction layer disposed on the insulation layer, wherein the light-emitting diode chips are electrically connected to the electric conduction layer; and an encapsulation layer covering the light-emitting diode chips, the electric conduction layer and the insulation layer.

Abstract: A light-emitting diode (LED) light source module is described, comprising: a heat conduction substrate, wherein a surface of the heat conduction substrate includes a plurality of recesses; a plurality of light-emitting diode chips respectively disposed in the recesses; an insulation layer disposed on the surface of the heat conduction substrate outside of the recesses; an electric conduction layer disposed on the insulation layer, wherein the light-emitting diode chips are electrically connected to the electric conduction layer; and an encapsulation layer covering the light-emitting diode chips, the electric conduction layer and the insulation layer.

Abstract: The UV resin used in the present invention is spread on the surface of a mother mold with lines. Illuminate UV light to harden the UV resin after it penetrated the lines completely. Thereby, to the depth and the shape of the lines of a pattern with deep lines, a complete duplication can be obtained in order to solve the deficiency of mother plate manufacturing technique at present. A seam between two mother plates is more smooth and has less influence on the lines structures at two sides thereof when a plurality of mother plate units are assembled to a big mother plate. The present invention provides an easy and novel plates assembly technique that gives consideration to both the lines in succeeding electroplating and impression procedures and required flatness for seams. Thereby, a seam between two mother plates is more smooth and has less influence on the lines structures at two sides thereof when a plurality of mother plate units are assembled to a big mother plate.