Patents by Inventor Hsinjin Edwin Yang

Hsinjin Edwin Yang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7135545
    Abstract: Methods are disclosed which utilize polycarbonate to form solid optical lenses. The polycarbonates may be selected from high molecular weight linear or branched species. Viscosity and melt flow are specified for improved mechanical properties. The method provides lenses with greater resistance to cracking and crazing, for example, in instances where flaws are subject to strain and require containment.
    Type: Grant
    Filed: April 29, 2004
    Date of Patent: November 14, 2006
    Assignee: Essilor International Compagnie General D'Optique
    Inventors: Hsinjin Edwin Yang, Hao Wen Chiu
  • Patent number: 6576162
    Abstract: Disclosed is an injection molding method. The method comprises injecting a melt of thermoplastic material at a temperature higher than the glass transition temperature (Tg) of the thermoplastic material in a molding cavity defined by a two-piece mold insert. The article is recovered after cooling and disassembling of the two piece mold insert. Each of the two pieces of the mold insert comprise at least one portion partly defining the mold cavity which is made of a material or combination of materials, other than glass, the thermal diffusivity &agr; of which fulfills the condition: 1<&agr;/&agr;g<11, wherein &agr;g is the thermal diffusivity of a borosilicate glass and is equal to 6.20×10−7 m2 s−1. The portion is at least 1 mm thick. The injection molding method can be used to form weld free minus lenses.
    Type: Grant
    Filed: April 30, 2001
    Date of Patent: June 10, 2003
    Assignee: Essilor International Compagnie Generale d'Optique
    Inventors: Hao-Wen Chiu, Hsinjin Edwin Yang
  • Publication number: 20030025226
    Abstract: Method comprises:
    Type: Application
    Filed: April 30, 2001
    Publication date: February 6, 2003
    Inventors: Hao Wen Chiu, Hsinjin Edwin Yang