Abstract: A metal mask includes: a metal frame, the metal frame being provided with a hollow region; and an alignment metal strip, the alignment metal strip being located at the edge of one side of the metal frame and being provided with a first align mark and a first photographing mark. The first align mark and the first photographing mark are arranged in the extending direction of the edge, the metal frame is provided with a first hole, and an orthographic projection of the first photographing mark on the metal frame is located within the area in which the first hole is located.

Abstract: A pixel structure includes a plurality of first sub-pixels arranged in a first direction and a second direction. A maximum dimension of at least one first sub-pixel in a first direction is less than a first set value, and a maximum dimension of the at least one first sub-pixel in a second direction is greater than a second set value. The first set value is a maximum dimension of a set sub-pixel in the first direction, and the second set value is a maximum dimension of the set sub-pixel in the second direction. The first sub-pixel has an area equal to an area of the set sub-pixel.

Abstract: A display panel is provided. The display panel includes: a substrate, and a light-emitting device, an encapsulation layer and an auxiliary barrier which are disposed on the substrate. The light-emitting device is disposed in a display area, and the auxiliary barrier is disposed in a non-display area. A height of the auxiliary barrier is greater than a distance between a side of the encapsulation layer away from the substrate and the substrate.

Abstract: A pixel structure includes a plurality of first sub-pixels arranged in a first direction and a second direction. A maximum dimension of at least one first sub-pixel in a first direction is less than a first set value, and a maximum dimension of the at least one first sub-pixel in a second direction is greater than a second set value. The first set value is a maximum dimension of a set sub-pixel in the first direction, and the second set value is a maximum dimension of the set sub-pixel in the second direction. The first sub-pixel has an area equal to an area of the set sub-pixel.

Abstract: A display module encapsulating structure and preparation method thereof, which relates to the field of display devices and can be applied to preparing AMOLED and other related display devices as described in the application, mainly use the thin film encapsulation structure to hermetically protect the display module (such as OLED display module), that is sealing the display module by inorganic thin film layer having the characteristics of transparency as well as containing moisture-resistance and oxygen-resistance; buffering the internal and external stresses of the thin film layers and restraining the falling off of the layers caused by the bending stress when preparing flexible devices. Meanwhile, the raised features formed by multilayer stack can effectively inhibit the diffusion effect of inorganic coating and increase the number of side water retaining walls of thin film device, therefore, effectively improve the encapsulating effect.

Abstract: A display module encapsulation structure and preparation method thereof, which relates to the field of display devices and can be applied in preparing AMOLED and other related display devices. The structure and method thereof mainly seals and protects the display module by utilizing the thin film encapsulation structure. That is to say, seal the display module by inorganic thin film layer which has the characteristics of transparency as well as water-resistance oxygen, buffer the internal and external stress of the thin film layer by preparing the organic module outside to the inorganic thin layer, and restrain the film layer falling off caused by the bending stress when making flexible devices. The thin film encapsulation instead of fit encapsulation can effectively improve the mechanical strength of the whole display device.

Abstract: An encapsulation structure of the display unit and a method of forming the same, mainly use the thin film encapsulation structure to hermetically protect the display unit (such as OLED display unit), that is sealing the display unit by inorganic thin film layer having the characteristics of transparency as well as containing moisture-resistance and oxygen-resistance; buffering the internal and external stresses of the thin film layers and restraining the falling off of the layers caused by the bending stress when forming flexible devices. Meanwhile, the bank features formed by multilayer stack can effectively inhibit the diffusion effect of inorganic coating and the increase of the number of side water retaining walls of thin film device can improve the effect of encapsulation, and the bank structures act as a support of the metal mask during the coating process to prevent the substrate from the damage caused by the metal mask.

Abstract: A display module encapsulating structure and preparation method thereof, which relates to the field of display devices and can be applied to preparing AMOLED and other related display devices as described in the application, mainly use the thin film encapsulation structure to hermetically protect the display module (such as OLED display module), that is sealing the display module by inorganic thin film layer having the characteristics of transparency as well as containing moisture-resistance and oxygen-resistance; buffering the internal and external stresses of the thin film layers and restraining the falling off of the layers caused by the bending stress when preparing flexible devices. Meanwhile, the raised features formed by multilayer stack can effectively inhibit the diffusion effect of inorganic coating and increase the number of side water retaining walls of thin film device, therefore, effectively improve the encapsulating effect.