Patents by Inventor HSIU-CHING HU

HSIU-CHING HU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of a rigid flex board module
    Patent number: 9900997
    Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.
    Type: Grant
    Filed: December 31, 2015
    Date of Patent: February 20, 2018
    Assignee: Unimicron Technology Corp.
    Inventors: Chi-Shiang Chen, Hsiu-Ching Hu, Kun-Wu Li, Fang-Ping Wu
  • RIGID FLEX BOARD MODULE AND THE MANUFACTURING METHOD THEREOF
    Publication number: 20160113125
    Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.
    Type: Application
    Filed: December 31, 2015
    Publication date: April 21, 2016
    Inventors: Chi-Shiang Chen, Hsiu-Ching Hu, Kun-Wu Li, Fang-Ping Wu
  • Rigid flex board module and the manufacturing method thereof
    Patent number: 9253898
    Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.
    Type: Grant
    Filed: December 2, 2013
    Date of Patent: February 2, 2016
    Assignee: Unimicron Technology Corp.
    Inventors: Chi-Shiang Chen, Hsiu-Ching Hu, Kun-Wu Li, Fang-Ping Wu
  • RIGID FLEX BOARD MODULE AND THE MANUFACTURING METHOD THEREOF
    Publication number: 20150053463
    Abstract: A rigid flex board module includes a rigid flex circuit board and a high-density interconnected circuit board. The rigid flex circuit board includes a flexible circuit board, a first rigid circuit board and a first adhesive layer. The flexible circuit board includes a bending portion and a jointing portion connected to the bending part. The rigid flex circuit board is disposed on the jointing portion to expose the bending portion. The first rigid circuit board electrically connects with the flexible circuit board. The first adhesive layer connects the first rigid circuit board and the jointing portion. The high-density interconnected circuit board is disposed in the first rigid circuit board and is electrically connected to the first rigid circuit board.
    Type: Application
    Filed: December 2, 2013
    Publication date: February 26, 2015
    Applicant: UNIMICRON TECHNOLOGY CORP.
    Inventors: CHI-SHIANG CHEN, HSIU-CHING HU, KUN-WU LI, FANG-PING WU