Patents by Inventor Hsiu-Chung Lin

Hsiu-Chung Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 7238897
    Abstract: A contact sensor includes a base, a wall device securely attached to the top face of the base and having a hole defined in the wall device to correspond to the top contacts so as to allow the top contacts of the base to be exposed and a chip receiving space defined to communicate with the hole, a sensing chip received in the chip receiving space and having a sensing area formed on top of the sensing chip and contacts formed thereon to electrically connect to the top contacts of the base and a cover received in the hole to enclose the contacts of the sensing chip and the top contacts of the base yet still allowing the sensing area exposed for application.
    Type: Grant
    Filed: December 7, 2005
    Date of Patent: July 3, 2007
    Assignee: Taiwan IC Packaging Corporation
    Inventors: Ching-Chung Tseng, Chung-Chi Yang, Hsiu-Chung Lin, Chun-I Kao, Hsiang-Hsin Kuo
  • Publication number: 20070125632
    Abstract: A contact sensor includes a base, a wall device securely attached to the top face of the base and having a hole defined in the wall device to correspond to the top contacts so as to allow the top contacts of the base to be exposed and a chip receiving space defined to communicate with the hole, a sensing chip received in the chip receiving space and having a sensing area formed on top of the sensing chip and contacts formed thereon to electrically connect to the top contacts of the base and a cover received in the hole to enclose the contacts of the sensing chip and the top contacts of the base yet still allowing the sensing area exposed for application.
    Type: Application
    Filed: December 7, 2005
    Publication date: June 7, 2007
    Inventors: Ching-Chung Tseng, Chung-Chi Yang, Hsiu-Chung Lin, Chun-I Kao, Hsiang-Hsin Kuo