Patents by Inventor Hsiu Fang Tsai

Hsiu Fang Tsai has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • ELECTRONIC PACKAGE AND MANUFACTURING METHOD THEREOF, AND SUBSTRATE STRUCTURE
    Publication number: 20240145372
    Abstract: A substrate structure is provided, in which an insulating protection layer is formed on a substrate body having a plurality of electrical contact pads, and the insulating protection layer has a plurality of openings corresponding to the plurality of exposed electrical contact pads, and the insulating protection layer is formed with a hollow portion surrounding a partial edge of at least one of the electrical contact pads at at least one of the openings, so as to reduce the barrier of the insulating protection layer.
    Type: Application
    Filed: December 22, 2022
    Publication date: May 2, 2024
    Applicant: SILICONWARE PRECISION INDUSTRIES CO., LTD.
    Inventors: Chia-Wen TSAO, Wen-Chen HSIEH, Yi-Lin TSAI, Hsiu-Fang CHIEN
  • Memory card
    Patent number: D647096
    Type: Grant
    Filed: November 8, 2010
    Date of Patent: October 18, 2011
    Assignee: Orient Semiconductor Electronics, Limited
    Inventors: Yueh Ming Tung, Chia Ming Yang, Hsiu Fang Tsai, Shu Hui Lin, Hung Lin Chiang
  • Memory card
    Patent number: D647097
    Type: Grant
    Filed: November 12, 2010
    Date of Patent: October 18, 2011
    Assignee: Orient Semiconductor Electronics, Limited
    Inventors: Yueh Ming Tung, Chia Ming Yang, Hsiu Fang Tsai, Shu Hui Lin, Hung Lin Chiang