Abstract: The present invention discloses a semi-etching method, which comprises the steps of etching a flip chip bump when producing a lead frame for packaging; electroplating a metal such as gold, silver, or solder onto the flip chip bump by an electroplating process; electrically connecting the bond pad of a chip and the flip chip bump; and injecting a packaging material for the packaging. The manufacturing process of the invention does not need to grow flip chip bumps (or solder balls) on the bond pad, but only uses the original manufacturing equipments for producing the lead frame. Therefore, the invention can greatly reduce the complexity of the manufacturing process and achieve the effect of lowering costs.