Patents by Inventor Hsiu-Hui HUNG

Hsiu-Hui HUNG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20220354883
    Abstract: Disclosed herein are methods for inhibiting pathogenic infection and inhibiting growth of pathogens using a conductive polymer material including a conductive component. The conductive component contains poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate), and a molar ratio of poly(3,4-ethylenedioxythiophene) to poly(styrenesulfonate) in the poly(3,4-ethylenedioxythiophene)-poly(styrenesulfonate) ranges from 1:1 to 1:25.
    Type: Application
    Filed: May 4, 2022
    Publication date: November 10, 2022
    Inventors: Ming-Lang LEE, Chuan-Te YEN, Yan-Jun WEN, Hsiu-Hui HUNG