Patents by Inventor Hsiu Hui Yeh

Hsiu Hui Yeh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10832932
    Abstract: A semiconductor product testing device using an electric static carrier includes a movable carrier plate serving to carry at least one semiconductor product for transferring or testing process; the movable carrier plate being arranged with at least one electric static circuit to suck the at least one semiconductor product; a movable detecting probe set including: a probe set includes at one probe or a plurality of probes; a robot being connected to the probe set for deriving the probe set to a predetermined test position; a control device connected to the robot and including a control circuit for controlling movements of the robot and a testing circuit; and a computer connected to the control device for getting testing data from the testing circuit; the computer providing functions to cause the user to determine test items and ways of the testing circuit and the moving paths of the robot.
    Type: Grant
    Filed: February 8, 2018
    Date of Patent: November 10, 2020
    Inventor: Hsiu Hui Yeh
  • Patent number: 10605247
    Abstract: An axleless blade set includes an annular frame and a driving structure. The driving structure serves to drive the annular frame. Blades extend from an inner wall of the annular frame and an outer wall of the annular frame is formed with a plurality of driving sheets. The driving structure serves to drive the driving sheets so as to drive the annular frame and the blades therein to rotate. As a result, wind blows from one side to another side along an axial direction with a large strength. Therefore defects of wind blowing from prior art fans of low strength and dispersing randomly are resolved.
    Type: Grant
    Filed: August 22, 2017
    Date of Patent: March 31, 2020
    Inventor: Hsiu Hui Yeh
  • Publication number: 20190378743
    Abstract: A semiconductor product testing device using an electric static carrier includes a movable carrier plate serving to carry at least one semiconductor product for transferring or testing process; the movable carrier plate being arranged with at least one electric static circuit to suck the at least one semiconductor product; a movable detecting probe set including: a probe set includes at one probe or a plurality of probes; a robot being connected to the probe set for deriving the probe set to a predetermined test position; a control device connected to the robot and including a control circuit for controlling movements of the robot and a testing circuit; and a computer connected to the control device for getting testing data from the testing circuit; the computer providing functions to cause the user to determine test items and ways of the testing circuit and the moving paths of the robot.
    Type: Application
    Filed: February 8, 2018
    Publication date: December 12, 2019
    Inventor: HSIU HUI YEH
  • Publication number: 20190063444
    Abstract: An axleless blade set includes an annular frame and a driving structure. The driving structure serves to drive the annular frame. Blades extend from an inner wall of the annular frame and an outer wall of the annular frame is formed with a plurality of driving sheets. The driving structure serves to drive the driving sheets so as to drive the annular frame and the blades therein to rotate. As a result, wind blows from one side to another side along an axial direction with a large strength. Therefore defects of wind blowing from prior art fans of low strength and dispersing randomly are resolved.
    Type: Application
    Filed: August 22, 2017
    Publication date: February 28, 2019
    Inventor: HSIU HUI YEH
  • Patent number: 10062676
    Abstract: A multilayer chipset structure is provided. The chips can be arranged in a stacking structure with multilayer circuit board. Each circuit board is formed with wiring opening and chipset opening. The chipset opening can be arranged with at least one chipset, such as a controller. The different openings cause connecting wires can pass therethrough so as to connect different chips or circuit elements on different layer. By this modularized structure, the multilayer package structure can be formed with a complicated structure in one package so as to reduce the packaging cost effectively. The connecting wires pass through the openings so as to reduce the whole path lengths needed. No complicated wiring is needed. All the conducting wires are at an upper side of the chips. In packaging, it only needs to package the upper side.
    Type: Grant
    Filed: May 25, 2017
    Date of Patent: August 28, 2018
    Inventor: Hsiu Hui Yeh