Abstract: A package structure includes: a substrate includes a first surface; a semiconductor chip disposed on the first surface; a support disposed on the first surface and surrounding the semiconductor chip comprises an electrical conducting member and penetrating the support; and an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member.

Abstract: A package structure includes: a substrate includes a first surface; a semiconductor chip disposed on the first surface; a support disposed on the first surface and surrounding the semiconductor chip comprises an electrical conducting member and penetrating the support; and an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member.

Abstract: A chip package structure includes a substrate having a first surface and a second surface being opposite surfaces of the substrate; a housing disposed on the first surface of the substrate and enclosing a chip region; and a chip set disposed in the chip region and electrically connected to the substrate. The chip set includes a first chip and a second chip, and an active surface of the second chip faces the active surface of the first chip.

Abstract: A package structure of a laser device is provided, including: a first light transmissive substrate including a first surface, a second surface opposing the first surface, a first side surface between the first surface and the second surface, and a second side surface opposing the first side surface; a laser structure including a first laser chip and a second laser chip which are disposed on the first surface, and the first laser chip including a third side surface; a first optical component disposing on the first light transmissive substrate and corresponding in position to the first laser chip; and a second optical component disposing on the light transmissive substrate and corresponding in position to the second laser chip; wherein the first side surface is coplanar with the third side surface.

Abstract: A package structure includes: a substrate includes a first surface; a semiconductor chip disposed on the first surface; a support disposed on the first surface and surrounding the semiconductor chip comprises an electrical conducting member and penetrating the support; and an optical component disposed on the support and electrically connected to the substrate by the electrical conducting member.

Abstract: An induction heating cooker and a control circuit therefor are provided. The cooker includes a switch element and an inductive coil, which is coupled between a power voltage and a first terminal of the switch element. A second terminal of the switch element is coupled to a common voltage. The control circuit includes first and second comparators and a pulse generator. The first comparator receives voltages of two terminals of the inductive coil and thus outputs a trigger signal. The second comparator receives a reference voltage and a voltage of the first terminal of the switch element, and enables a fading signal when the voltage of the first terminal is higher than the reference voltage. When the trigger signal is enabled, the pulse generator outputs a pulse to control the switch element. When the fading signal is enabled, the pulse generator reduces a pulse width of the pulse.

Abstract: An induction heating cooker includes a switch element and an inductive coil, which is coupled between a power voltage and a first terminal of the switch element. A second terminal of the switch element is coupled to a common voltage. A control circuit for controlling the inducting heating cooker includes first and second comparators and a pulse generator. The first comparator receives voltages of two terminals of the inductive coil and thus outputs a trigger signal. The second comparator receives a reference voltage and a voltage of the first terminal of the switch element, and enables a fading signal when the voltage of the first terminal is higher than the reference voltage. When the trigger signal is enabled, the pulse generator outputs a pulse to control the switch element. When the fading signal is enabled, the pulse generator reduces a pulse width of the pulse.

Abstract: A sensing method for a capacitive touch panel includes charging a measure capacitor, setting the voltage across a mutual capacitor at the intersection of two traces of the capacitive touch panel, and then injecting partial charges of the measure capacitor into the mutual capacitor. When the intersection is touched, the capacitance value of the mutual capacitor is changed, and consequently the amount of charges injected into the mutual capacitor is changed. Hence, the voltage of the measure capacitor could be detected to determine whether or not the intersection is touched.

Abstract: An induction heating cooker and a control circuit therefor are provided. The cooker includes a switch element and an inductive coil, which is coupled between a power voltage and a first terminal of the switch element. A second terminal of the switch element is coupled to a common voltage. The control circuit includes first and second comparators and a pulse generator. The first comparator receives voltages of two terminals of the inductive coil and thus outputs a trigger signal. The second comparator receives a reference voltage and a voltage of the first terminal of the switch element, and enables a fading signal when the voltage of the first terminal is higher than the reference voltage. When the trigger signal is enabled, the pulse generator outputs a pulse to control the switch element. When the fading signal is enabled, the pulse generator reduces a pulse width of the pulse.

Abstract: A sensing method for a capacitive touch panel includes charging a measure capacitor, setting the voltage across a mutual capacitor at the intersection of two traces of the capacitive touch panel, and then injecting partial charges of the measure capacitor into the mutual capacitor. When the intersection is touched, the capacitance value of the mutual capacitor is changed, and consequently the amount of charges injected into the mutual capacitor is changed. Hence, the voltage of the measure capacitor could be detected to determine whether or not the intersection is touched.

Abstract: The invention relates to an induction heating cooker and a control circuit therefor. The cooker includes a switch element and an inductive coil, which is coupled between a power voltage and a first terminal of the switch element. A second terminal of the switch element is coupled to a common voltage. The control circuit includes first and second comparators and a pulse generator. The first comparator receives voltages of two terminals of the inductive coil and thus outputs a trigger signal. The second comparator receives a reference voltage and a voltage of the first terminal of the switch element, and enables a fading signal when the voltage of the first terminal is higher than the reference voltage. When the trigger signal is enabled, the pulse generator outputs a pulse to control the switch element. When the fading signal is enabled, the pulse generator reduces a pulse width of the pulse.