Abstract: A carrier structure is provided, in which at least one positioning area is defined on a chip-placement area of a package substrate, and at least one alignment portion is disposed on the positioning area. Therefore, the precision of manufacturing the alignment portion is improved by disposing the positioning area on the chip-placement area, such that the carrier structure can provide a better alignment mechanism for the chip placement operation.

Abstract: An organizing device includes a cylindrical retainer member made of a resilient material and having one or more longitudinal grooves, and having one or more slots formed in an outer peripheral portion and communicative with the grooves for engaging a cable through the slot and into each of the grooves of the cylindrical retainer member, and a coupling member engaged with the cylindrical retainer member for coupling and attaching the cylindrical retainer member to a supporting facility. The cylindrical retainer member is made of a resilient material for retaining the cables to the cylindrical retainer member.