Abstract: A semiconductor package includes a semiconductor device, an encapsulating material, a redistribution structure, and an adhesive residue. The encapsulating material encapsulates a first part of a side surface of the semiconductor device. The redistribution structure is disposed over the semiconductor device and a first side of the encapsulating material. The adhesive residue is disposed over a second side of the encapsulating material opposite to the first side and surrounding the semiconductor device, wherein the adhesive residue encapsulates a second part of the side surface of the semiconductor device.

Abstract: The present invention provides a method of treating targeted abnormal cells that are resistant, refractory, insensitive, non-responsive, or inadequately responsive to an ingredient, as well as cytotoxic cells used therein, comprising administering an effective amount of the ingredient-complexed cytotoxic cells to a subject with the disease.

Abstract: A device includes a barrel for receiving objects and includes air supplied into the barrel for generating air eddy in order to disengage and to remove outer membrane from the objects. A shutter is pivotally coupled to the lower portion of the barrel for enclosing the open bottom of the barrel and for maintaining the objects within the barrel. The air eddy is supplied into the barrel from the bottom portion of the barrel for removing the outer membrane from the objects. The outer membranes may be removed without hurting the objects.