Patents by Inventor Hsiu-Ling Hung

Hsiu-Ling Hung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting diode and method for manufacturing the same
    Patent number: 10193041
    Abstract: A light emitting diode comprises a light emitting diode chip and a packaging layer. The light emitting diode chip comprises a N-semiconductor layer, a light active layer, and a P-semiconductor layer arranged from a bottom to a top in that sequence, a first electrode, and a second electrode. The first electrode is formed on the P-semiconductor layer. The second electrode is formed on the N-semiconductor layer. The packaging layer covers the light emitting diode chip, and exposes the N-semiconductor layer, the first electrode, and the second electrode. The packaging layer has a through hole separated from a periphery of the light emitting diode chip. A conductive substrate fills the through hole. A first conductive layer is electrically connected to the first electrode and the conductive substrate. The disclosure also provides a method for manufacturing a light emitting diode.
    Type: Grant
    Filed: November 16, 2017
    Date of Patent: January 29, 2019
    Assignee: ADVANCED OPTOELECTRONIC TECHNOLOGY, INC
    Inventors: Shih-Chuan Lin, Tsung-Han Chiang, Chun-Yao Lin, Chao-Ming Huang, Hsiu-Ling Hung, Tzu-Chien Hung