Patents by Inventor Hsiu-Ling YU

Hsiu-Ling YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10736235
    Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
    Type: Grant
    Filed: September 13, 2018
    Date of Patent: August 4, 2020
    Assignee: ADLINK TECHNOLOGY INC.
    Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
  • Patent number: 10306805
    Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
    Type: Grant
    Filed: April 21, 2017
    Date of Patent: May 28, 2019
    Assignee: ADLINK TECHNOLOGY INC.
    Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
  • Patent number: 10212859
    Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
    Type: Grant
    Filed: March 31, 2015
    Date of Patent: February 19, 2019
    Assignee: ADLINK TECHNOLOGY INC.
    Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
  • Publication number: 20190014689
    Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
    Type: Application
    Filed: September 13, 2018
    Publication date: January 10, 2019
    Inventors: Hsiu-Ling YU, Hsuan-Chan CHIANG
  • Publication number: 20170231117
    Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
    Type: Application
    Filed: April 21, 2017
    Publication date: August 10, 2017
    Inventors: Hsiu-Ling YU, Hsuan-Chan Chiang
  • Publication number: 20170223818
    Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
    Type: Application
    Filed: April 21, 2017
    Publication date: August 3, 2017
    Inventors: Hsiu-Ling YU, Hsuan-Chan Chiang
  • Patent number: 9658658
    Abstract: A data storage device mounting structure includes a data storage device insertable through an insertion slot into an accommodation chamber in an electronic device, a mounting assembly including a mounting plate affixed to one corner of the data storage device and a metal wire rod having a middle part thereof bent backwards to provide a curved arch portion and two opposite ends thereof connected to one end of the mounting plate, and an operating handle fixedly fastened to the curved arch portion of the metal wire rod and operable by the user to drag the metal wire rod in pulling the data storage device out of the accommodation chamber of the electronic apparatus conveniently with less effort. The mounting assembly and the operating handle have a small size, and are easy and inexpensive to manufacture.
    Type: Grant
    Filed: October 21, 2015
    Date of Patent: May 23, 2017
    Assignee: Adlink Technology Inc.
    Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
  • Publication number: 20170115706
    Abstract: A data storage device mounting structure includes a data storage device insertable through an insertion slot into an accommodation chamber in an electronic device, a mounting assembly including a mounting plate affixed to one corner of the data storage device and a metal wire rod having a middle part thereof bent backwards to provide a curved arch portion and two opposite ends thereof connected to one end of the mounting plate, and an operating handle fixedly fastened to the curved arch portion of the metal wire rod and operable by the user to drag the metal wire rod in pulling the data storage device out of the accommodation chamber of the electronic apparatus conveniently with less effort. The mounting assembly and the operating handle have a small size, and are easy and inexpensive to manufacture.
    Type: Application
    Filed: October 21, 2015
    Publication date: April 27, 2017
    Inventors: Hsiu-Ling YU, Hsuan-Chan CHIANG
  • Publication number: 20160295743
    Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.
    Type: Application
    Filed: March 31, 2015
    Publication date: October 6, 2016
    Inventors: Hsiu-Ling YU, Hsuan-Chan CHIANG