Patents by Inventor Hsiu-Ling YU
Hsiu-Ling YU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10736235Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.Type: GrantFiled: September 13, 2018Date of Patent: August 4, 2020Assignee: ADLINK TECHNOLOGY INC.Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
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Patent number: 10306805Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.Type: GrantFiled: April 21, 2017Date of Patent: May 28, 2019Assignee: ADLINK TECHNOLOGY INC.Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
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Patent number: 10212859Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.Type: GrantFiled: March 31, 2015Date of Patent: February 19, 2019Assignee: ADLINK TECHNOLOGY INC.Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
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Publication number: 20190014689Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.Type: ApplicationFiled: September 13, 2018Publication date: January 10, 2019Inventors: Hsiu-Ling YU, Hsuan-Chan CHIANG
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Publication number: 20170231117Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.Type: ApplicationFiled: April 21, 2017Publication date: August 10, 2017Inventors: Hsiu-Ling YU, Hsuan-Chan Chiang
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Publication number: 20170223818Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.Type: ApplicationFiled: April 21, 2017Publication date: August 3, 2017Inventors: Hsiu-Ling YU, Hsuan-Chan Chiang
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Patent number: 9658658Abstract: A data storage device mounting structure includes a data storage device insertable through an insertion slot into an accommodation chamber in an electronic device, a mounting assembly including a mounting plate affixed to one corner of the data storage device and a metal wire rod having a middle part thereof bent backwards to provide a curved arch portion and two opposite ends thereof connected to one end of the mounting plate, and an operating handle fixedly fastened to the curved arch portion of the metal wire rod and operable by the user to drag the metal wire rod in pulling the data storage device out of the accommodation chamber of the electronic apparatus conveniently with less effort. The mounting assembly and the operating handle have a small size, and are easy and inexpensive to manufacture.Type: GrantFiled: October 21, 2015Date of Patent: May 23, 2017Assignee: Adlink Technology Inc.Inventors: Hsiu-Ling Yu, Hsuan-Chan Chiang
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Publication number: 20170115706Abstract: A data storage device mounting structure includes a data storage device insertable through an insertion slot into an accommodation chamber in an electronic device, a mounting assembly including a mounting plate affixed to one corner of the data storage device and a metal wire rod having a middle part thereof bent backwards to provide a curved arch portion and two opposite ends thereof connected to one end of the mounting plate, and an operating handle fixedly fastened to the curved arch portion of the metal wire rod and operable by the user to drag the metal wire rod in pulling the data storage device out of the accommodation chamber of the electronic apparatus conveniently with less effort. The mounting assembly and the operating handle have a small size, and are easy and inexpensive to manufacture.Type: ApplicationFiled: October 21, 2015Publication date: April 27, 2017Inventors: Hsiu-Ling YU, Hsuan-Chan CHIANG
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Publication number: 20160295743Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.Type: ApplicationFiled: March 31, 2015Publication date: October 6, 2016Inventors: Hsiu-Ling YU, Hsuan-Chan CHIANG