Patents by Inventor Hsiu-Mei Yo

Hsiu-Mei Yo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Crosstalk-free WLCSP structure for high frequency application
    Patent number: 8669658
    Abstract: A structure, a system, and a method for manufacture of crosstalk-free wafer level chip scale packaging (WLCSP) structure for high frequency applications is provided. An illustrative embodiment comprises a substrate on which various layers and structures form circuitry, a signal pin formed on the substrate and coupled with the circuitry, a ground ring encircling the signal pin, and a grounded solder bump coupled to the ground ring.
    Type: Grant
    Filed: July 24, 2007
    Date of Patent: March 11, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Mon-Chin Tsai, Hsiu-Mei Yo, Chien-Min Lin, Chia-Jen Cheng, Li-Hsin Tseng
  • Crosstalk-Free WLCSP Structure for High Frequency Application
    Publication number: 20090026608
    Abstract: A structure, a system, and a method for manufacture of crosstalk-free wafer level chip scale packaging (WLCSP) structure for high frequency applications is provided. An illustrative embodiment comprises a substrate on which various layers and structures form circuitry, a signal pin formed on the substrate and coupled with the circuitry, a ground ring encircling the signal pin, and a grounded solder bump coupled to the ground ring.
    Type: Application
    Filed: July 24, 2007
    Publication date: January 29, 2009
    Inventors: Mon-Chin Tsai, Hsiu-Mei Yo, Chien-Min Lin, Chia-Jen Cheng, Li-Hsin Tseng