Patents by Inventor Hsiu-Min Lin

Hsiu-Min Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20120173731
    Abstract: A system and a method for starting a cloud computing service according to a user location are disclosed, the system comprises an authentication server, a central management server, a central database management server, a central storage server, a local management server, a local computing server, and a local storage server to determine a user access location, and to distribute cloud computing resources, thereby providing a simple, convenient and efficient cloud computing service.
    Type: Application
    Filed: December 29, 2011
    Publication date: July 5, 2012
    Applicant: CHUNGHWA TELECOM CO., LTD.
    Inventors: Hsiu Min Lin, Hsiao Feng Yeh, Cheng Ju Yu, Chih Cheng Chien, Peng Yi Lai
  • Publication number: 20110206813
    Abstract: A method to determine oxidative and reductive substances in food, which is realized with a testing specimen and a measuring device, and which comprises steps: pre-processing an appropriate amount of a food specimen; dissolving a given amount of the pre-processed food specimen in a buffer solution; making the buffer solution dissolving a tested material contact with a formulated layer on the testing specimen to proceed a redox reaction; the measuring device supplying a reaction potential to reaction electrodes of the testing specimen to obtain an electrical signal; and obtaining a content of the tested material from the electrical signal. Besides, the testing specimen and the measuring device used to implement the abovementioned method are also disclosed.
    Type: Application
    Filed: February 22, 2010
    Publication date: August 25, 2011
    Inventors: Yen-Yuan SHEN, Hsiu-Min Lin, Edward Chen
  • Patent number: 7164283
    Abstract: Auto-recovery wafer testing apparatus and wafer testing method are provided. The wafer testing apparatus includes a main system, a tester and a real-time accessing module. The main system controls the process of the wafer testing. The tester is electrically coupled to the main system for receiving commands from the main system to perform testing on a plurality of chips sequentially and output the testing data correspondingly. The real-time accessing module is electrically coupled to the tester for simultaneously accessing the testing data. In an event when the testing is accidentally interrupted, the tester can produce auto-recovery data according to the testing data saved in the real-time accessing module, and continue testing, based on the auto-recovery data, from the chip being last but incompletely tested. The use of the wafer testing apparatus and method can save testing time and enhance the production efficiency.
    Type: Grant
    Filed: July 5, 2005
    Date of Patent: January 16, 2007
    Assignee: Powerchip Semiconductor Corp.
    Inventors: Chiou-Ping Wu, Hsiu-Min Lin
  • Patent number: 6963213
    Abstract: Auto-recovery wafer testing apparatus and wafer testing method are provided. The wafer testing apparatus includes a main system, a tester and a real-time accessing module. The main system controls the process of the wafer testing. The tester is electrically coupled to the main system for receiving commands from the main system to perform testing on a plurality of chips sequentially and output the testing data correspondingly. The real-time accessing module is electrically coupled to the tester for simultaneously accessing the testing data. In an event when the testing is accidentally interrupted, the tester can produce auto-recovery data according to the testing data saved in the real-time accessing module, and continue testing, based on the auto-recovery data, from the chip being last but incompletely tested. The use of the wafer testing apparatus and method can save testing time and enhance the production efficiency.
    Type: Grant
    Filed: July 28, 2004
    Date of Patent: November 8, 2005
    Assignee: Powerchip Semiconductor Corp.
    Inventors: Chiou-Ping Wu, Hsiu-Min Lin
  • Publication number: 20050231190
    Abstract: Auto-recovery wafer testing apparatus and wafer testing method are provided. The wafer testing apparatus includes a main system, a tester and a real-time accessing module. The main system controls the process of the wafer testing. The tester is electrically coupled to the main system for receiving commands from the main system to perform testing on a plurality of chips sequentially and output the testing data correspondingly. The real-time accessing module is electrically coupled to the tester for simultaneously accessing the testing data. In an event when the testing is accidentally interrupted, the tester can produce auto-recovery data according to the testing data saved in the real-time accessing module, and continue testing, based on the auto-recovery data, from the chip being last but incompletely tested. The use of the wafer testing apparatus and method can save testing time and enhance the production efficiency.
    Type: Application
    Filed: July 28, 2004
    Publication date: October 20, 2005
    Inventors: Chiou-Ping Wu, Hsiu-Min Lin
  • Publication number: 20050235181
    Abstract: Auto-recovery wafer testing apparatus and wafer testing method are provided. The wafer testing apparatus includes a main system, a tester and a real-time accessing module. The main system controls the process of the wafer testing. The tester is electrically coupled to the main system for receiving commands from the main system to perform testing on a plurality of chips sequentially and output the testing data correspondingly. The real-time accessing module is electrically coupled to the tester for simultaneously accessing the testing data. In an event when the testing is accidentally interrupted, the tester can produce auto-recovery data according to the testing data saved in the real-time accessing module, and continue testing, based on the auto-recovery data, from the chip being last but incompletely tested. The use of the wafer testing apparatus and method can save testing time and enhance the production efficiency.
    Type: Application
    Filed: July 5, 2005
    Publication date: October 20, 2005
    Inventors: Chiou-Ping Wu, Hsiu-Min Lin