Patents by Inventor Hsiu-Ming HSIEH

Hsiu-Ming HSIEH has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Chip array structure for laser diodes and packaging device for the same
    Patent number: 9293893
    Abstract: A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.
    Type: Grant
    Filed: September 19, 2014
    Date of Patent: March 22, 2016
    Assignee: TrueLight Corporation
    Inventors: Jin-Shan Pan, Chih-Cheng Chen, Hsiu-Ming Hsieh
  • Chip Array Structure for Laser Diodes and Packaging Device for the Device
    Publication number: 20150078412
    Abstract: A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.
    Type: Application
    Filed: September 19, 2014
    Publication date: March 19, 2015
    Applicant: TrueLight Corporation
    Inventors: Jin-Shan Pan, Chih-Cheng Chen, Hsiu-Ming Hsieh
  • Chip array structure for laser diodes and packaging device for the same
    Publication number: 20130308672
    Abstract: A chip array structure for laser diodes, formed on an active surface of a semiconductor chip produced from a semiconductor process includes a plurality of light-emitting elements in an array arrangement, at least one insulation wall, at least two wire bond areas and a plurality of connection electrodes. The insulation wall separates the light-emitting elements into at least two light-emitting districts. The wire bond areas are positioned respective to the corresponding light-emitting districts. The connection electrodes electrically couple the wire bond areas with the corresponding light-emitting districts. The wire bond areas have independent electrodes, and the light-emitting districts are electrically isolated by the insulation wall.
    Type: Application
    Filed: July 11, 2012
    Publication date: November 21, 2013
    Applicant: TruLight Corporation
    Inventors: Jin-Shan PAN, Chih-Cheng CHEN, Hsiu-Ming HSIEH