Patents by Inventor Hsiu-Pen Lin

Hsiu-Pen Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20230014165
    Abstract: Example implementations relate to electrical traces on panels. In some examples, a display can include an on-cell touch (OCT) panel, a cover panel, and an electrical trace located on the cover panel, where the cover panel is a glass panel and the electrical trace is to transmit a signal from a component to a processor.
    Type: Application
    Filed: December 13, 2019
    Publication date: January 19, 2023
    Inventors: Chung LIN CHEN, Hsiu-Pen LIN, Lien Chia CHIU, KUN CHENG TSAI
  • Patent number: 10543657
    Abstract: In one example, a housing for an electronic device may be disclosed which may include a first multi-layer structure. The first multi-layer structure may include a first layer and a second layer formed on the first layer. Each of the first layer and the second layer may include a plurality of protruding features and a plurality of recessing features on an edge of the first layer and the second layer. At least one of the plurality of recessing features of one layer may intersect at least one of the plurality of protruding features of other layer.
    Type: Grant
    Filed: April 5, 2016
    Date of Patent: January 28, 2020
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hsiu-Pen Lin, Kun-Cheng Tsai, Chienchih Chiu
  • Publication number: 20190016082
    Abstract: In one example, a housing for an electronic device may be disclosed which may include a first multi-layer structure. The first multi-layer structure may include a first layer and a second layer formed on the first layer. Each of the first layer and the second layer may include a plurality of protruding features and a plurality of recessing features on an edge of the first layer and the second layer. At least one of the plurality of recessing features of one layer may intersect at least one of the plurality of protruding features of other layer.
    Type: Application
    Filed: April 5, 2016
    Publication date: January 17, 2019
    Inventors: HSIU-PEN LIN, KUN-CHENG TSAI, CHIENCHIH CHIU
  • Publication number: 20170342217
    Abstract: An antibody includes a polyamidoamine (PAMAM) dendrimer and a first functional group. The polyamidoamine (PAMAM) dendrimer includes a plurality of branches and each of the branches has a phenylboronic acid (PBA) terminal group. The first functional group is bonded to at least one of the PBA terminal groups.
    Type: Application
    Filed: August 10, 2017
    Publication date: November 30, 2017
    Inventors: Yaw-Kuen LI, Mo-Yuan SHEN, Hsiu-Pen LIN
  • Publication number: 20160222173
    Abstract: A dendrimer represented by formula (I): G0-G10 represent a generation 0-10 dendrimer; the dendrimer has a plurality of branches; each branch has a terminal group; and n is an integer of 4-4096.
    Type: Application
    Filed: January 26, 2016
    Publication date: August 4, 2016
    Inventors: Yaw-Kuen LI, Mo-Yuan SHEN, Hsiu-Pen Lin
  • Publication number: 20150138727
    Abstract: An electronic apparatus including a body, a first connector, and a holder is provided. The body has a slot. The first connector is installed in the slot. The holder is pivoted to an internal wall of the slot to be rotated between a first position and a second position. The holder has a supporting surface. When a second connector is inserted into the slot to connect the first connector, the second connector presses the supporting surface to cause the holder to rotate from the first position to the second position, such that a portion of the second connector is supported on the supporting surface.
    Type: Application
    Filed: May 30, 2014
    Publication date: May 21, 2015
    Applicant: Acer Incorporated
    Inventor: Hsiu-Pen Lin
  • Patent number: 8456437
    Abstract: A touch pad module assembly structure includes a housing, a touch pad module and a metal bracket. The housing includes a generally rectangular opening. The touch pad module is assembled into the opening. The touch pad module includes a support member and a circuit board. An edge of the support member has a through hole and a pair of resilient members. An opposite edge of the support member has a connection member secured to a surrounding surface of the opening. The circuit board is disposed over the support member and includes a switch aligned with the through hole. The metal bracket is secured to a surrounding edge of the opening to be in to contact with the switch and expose the connection member.
    Type: Grant
    Filed: March 10, 2010
    Date of Patent: June 4, 2013
    Assignee: Quanta Computer Inc.
    Inventors: Tsung-Ju Chiang, Hsiu-Pen Lin
  • Patent number: 8139347
    Abstract: A touch pad module assembly structure includes a housing and a touch module. The housing includes a generally rectangular concave area, which includes a bottom surface, two housing edges, a step, a position pin and a convex member. The step is disposed closer to one of the two housing edges than the other thereof. The position pin is disposed on an inner surface of the one of the two housing edges. The convex member is disposed closer to the other of the two housing edges. The touch module includes a support member, which includes a position member and a hook member. The position member is disposed at an edge of the support member and includes a position hole to be engaged with the position pin. The hook member is disposed at an opposite edge of the support member and coupled with the other of the two housing edges.
    Type: Grant
    Filed: March 4, 2010
    Date of Patent: March 20, 2012
    Assignee: Quanta Computer Inc.
    Inventors: Tsung-Ju Chiang, Hsiu-Pen Lin
  • Publication number: 20110080354
    Abstract: A touch pad module assembly structure includes a housing, a touch pad module and a metal bracket. The housing includes a generally rectangular opening. The touch pad module is assembled into the opening. The touch pad module includes a support member and a circuit board. An edge of the support member has a through hole and a pair of resilient members. An opposite edge of the support member has a connection member secured to a surrounding surface of the opening. The circuit board is disposed over the support member and includes a switch aligned with the through hole. The metal bracket is secured to a surrounding edge of the opening to be in to contact with the switch and expose the connection member.
    Type: Application
    Filed: March 10, 2010
    Publication date: April 7, 2011
    Applicant: Quanta Computer Inc.
    Inventors: Tsung-Ju Chiang, Hsiu-Pen Lin
  • Publication number: 20110075336
    Abstract: A touch pad module assembly structure includes a housing and a touch module. The housing includes a generally rectangular concave area, which includes a bottom surface, two housing edges, a step, a position pin and a convex member. The step is disposed closer to one of the two housing edges than the other thereof. The position pin is disposed on an inner surface of the one of the two housing edges. The convex member is disposed closer to the other of the two housing edges. The touch module includes a support member, which includes a position member and a hook member. The position member is disposed at an edge of the support member and includes a position hole to be engaged with the position pin. The hook member is disposed at an opposite edge of the support member and coupled with the other of the two housing edges.
    Type: Application
    Filed: March 4, 2010
    Publication date: March 31, 2011
    Applicant: Quanta Computer Inc.
    Inventors: Tsung-Ju Chiang, Hsiu-Pen Lin