Abstract: An embodiment composite material for semiconductor package mount applications may include a first component including a tin-silver-copper alloy and a second component including a tin-bismuth alloy or a tin-indium alloy. The composite material may form a reflowed bonding material having a room temperature tensile strength in a range from 80 MPa to 100 MPa when subjected to a reflow process. The reflowed bonding material may include a weight fraction of bismuth that is in a range from approximately 4% to approximately 15%. The reflowed bonding material may an alloy that is solid solution strengthened by a presence of bismuth or indium that is dissolved within the reflowed bonding material or a solid solution phase that includes a minor component of bismuth dissolved within a major component of tin. In some embodiments, the reflowed bonding material may include intermetallic compounds formed as precipitates such as Ag3Sn and/or Cu6Sn5.

Abstract: A method includes depositing solder paste over first contact pads of a first package component. Spring connectors of a second package component are aligned to the solder paste. The solder paste is reflowed to electrically and physically couple the spring connectors of the second package component to the first contact pads of the first package component. A device includes a first package component and a second package component electrically and physically coupled to the first package component by way of a plurality of spring coils. Each of the plurality of spring coils extends from the first package component to the second package component.

Abstract: A surface measurement system is configured to measure a sample with a low reflectivity surface. The surface measurement system includes a condensation device and a measurement device. The condensation device is configured to form a liquid layer on the surface of the sample. The condensation device includes a chamber, a temperature controlling gas source, and a humidification gas source. The chamber is configured to accommodate the sample. The temperature controlling gas source is connected to the chamber to provide temperature controlling gases to the chamber, so as to control the temperature of the sample. The humidification gas source is connected to the chamber to provide water vapor to the chamber, so as to form the liquid layer on the surface of the sample. The measurement device includes a plate, a light source, and an image capturing device.

Abstract: A surface measurement system is configured to measure a sample with a low reflectivity surface. The surface measurement system includes a condensation device and a measurement device. The condensation device is configured to form a liquid layer on the surface of the sample. The condensation device includes a chamber, a temperature controlling gas source, and a humidification gas source. The chamber is configured to accommodate the sample. The temperature controlling gas source is connected to the chamber to provide temperature controlling gases to the chamber, so as to control the temperature of the sample. The humidification gas source is connected to the chamber to provide water vapor to the chamber, so as to form the liquid layer on the surface of the sample. The measurement device includes a plate, a light source, and an image capturing device.

Abstract: An electrical probe includes a main body, a probe head and a plurality of pins. The probe head is disposed on the main body, and the probe head has a surface and a plurality of openings on the surface. Each pin includes a contacting portion and an inserting portion connected to each other. Each pin has an obtuse angle between the contacting portion and the inserting portion, and the inserting portions of the pins respectively inserted into the openings.

Abstract: A support apparatus is configured to support electronic components. The support apparatus includes a tray and a plurality of recessed structures. The tray has a cavity therein and at least one intake hole communicated with the cavity. The recessed structures are disposed on the tray and recessed toward the cavity. Each of the recessed structures is configured to accommodate at least a part of a corresponding one of the electronic components and includes a support surface and a plurality of first spacers. The support surface has an exhaust hole communicated with the cavity. The first spacers are disposed on the support surface of a corresponding one of the recessed structures. When a corresponding one of the electronic components is supported on the first spacers, any adjacent two of the first spacers and the corresponding electronic component form a first flow channel.

Abstract: A transformer includes an iron core, at least one winding, and at least one first thermally conductive member. The winding is wound onto the iron core. The winding has a plurality of wiring layers. The thermally conductive member is thermally connected between adjacent two of the wiring layers. The thermally conductive member is configured to circulate a heat transfer fluid therein.

Abstract: An electrical probe includes a main body, a probe head and a plurality of pins. The probe head is disposed on the main body, and the probe head has a surface and a plurality of openings on the surface. Each pin includes a contacting portion and an inserting portion connected to each other. Each pin has an obtuse angle between the contacting portion and the inserting portion, and the inserting portions of the pins respectively inserted into the openings.

Abstract: A probe includes a first electrical conductor, a second electrical conductor and a voltage measurer. The first electrical conductor has a first through hole, and the first through hole extends through two ends of the first electrical conductor. The second electrical conductor is detachably disposed on the first electrical conductor, and the second electrical conductor has a working surface and a second through hole. The working surface is located at an end of the second electrical conductor away from the first electrical conductor. Two ends of the second through hole that are opposite to each other are located at the working surface and an end of the first through hole, respectively. The first through hole is communicated with the second through hole. The voltage measurer is penetrating through the first through hole and the second through hole.

Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.

Abstract: The disclosure discloses a heating furnace including a housing, a first rack, a chamber, and at least one fan. The first rack is disposed in the housing. The chamber is disposed in the housing and located at a side of the first rack. The chamber includes an inlet, a first sidewall, and a second sidewall. The first sidewall is adjacent to the first rack. The first sidewall has a plurality of vents. The first sidewall and the second sidewall are disposed to face each other. A width is spaced between the first sidewall and the second sidewall, and the width is larger than or equal to 200 mm. The fan is disposed in the housing for generating an airflow to the inlet.