Abstract: An image sensor packaging structure with a low transmittance encapsulant is provided. The image sensor packaging structure includes a substrate, a chip, a transparent lid, and the low transmittance encapsulant. The chip is combined with the substrate. The transparent lid is adhered to the chip and cover above a sensitization area of the chip to form an air cavity. The low transmittance encapsulant is formed on the substrate and encapsulates the chip and the transparent lid so as to accomplish the package of the image sensor packaging structure. Due to the feature of prohibiting from light passing through the low transmittance encapsulant, the arrangement of the low transmittance encapsulant can avoid the light from outside interfere the image sensing effect of the image sensor. Therefore, the quality of the image sensing can be ensured.

Abstract: An image sensor packaging structure with a predetermined focal length is provided. The image sensor packaging structure includes a substrate, a chip, an optical assembly, and an encapsulation compound. The chip has a sensitization area and is coupled to the substrate. Conductive contacts on the substrate are electrically connected with conductive contacts around the sensitization area. The optical assembly has the predetermined focal length and is disposed above the chip so as to form an air cavity between the optical assembly and the sensitization area of the chip. The encapsulation compound is formed on the substrate to surround the chip and the optical assembly. With the above stated structure, not only can the focus adjusting procedure be dispensed with, but also the image sensor packaging structure can be manufactured by a molding or dispensing process.

Abstract: The present invention discloses an image sensor package structure with a large air cavity. The image sensor package structure includes a substrate, a chip, a cover and a package material. The chip is combined with the substrate. A plastic sheet of the cover is adhered to the chip and a transparent lid of the cover is combined with the plastic sheet to provide a covering over a sensitization area of the chip so as to form an air cavity. The package material is arranged on the substrate and encapsulated around the chip and the cover. The plastic sheet having a predetermined thickness can increase the distance between the transparent lid and the chip to enlarge the air cavity. Thus, the image-sensing effect of the image sensor package structure can be improved and the ghost image problem resulting from multi-refraction and multi-reflection of light can be minimized.

Abstract: The present invention discloses an image sensor package structure. The image sensor package structure includes a substrate, a chip, a transparent lid, a first casing and a package material. The transparent lid covers a sensitization area of the chip and it also adheres to the chip which is deposed on the substrate. The first casing, which adheres to the transparent lid, forms an opening so that light can pass through the opening and the transparent lid to enter into the sensitization area. The package material covers around the chip and the transparent lid and fills between the substrate and the first casing. Because of the arrangement of adhesive layers placed between the first casing and the transparent lid and between the transparent lid and the chip, the blockage area from moisture is elongated. Therefore, the reliability of the image sensor package structure can be enhanced.

Abstract: A manufacturing method for molding an image sensor package structure and the image sensor package structure thereof are disclosed. The manufacturing method includes following steps of providing a half-finished image sensor for packaging, arranging a dam on the peripheral of a transparent lid of the half-finished image sensor, positioning the half-finished image sensor within a mold, and injecting a mold compound into the mold cavity of the mold. The dam is arranged on the top surface of the transparent lid and the inner surface of the mold can exactly contact with the top surface of dam so that the mold compound injected into the mold cavity is prevented from overflowing to the transparent lid by the dam. Furthermore, the arrangement of the dam and the mold compound can increase packaged areas and extend blockage to invasive moisture so as to enhance the reliability of the image sensor package structure.

Abstract: An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.

Abstract: An image sensor package is provided including a substrate; a sensor chip; a plurality of bond wires for connecting the sensor chip to the substrate at predetermined locations; a sensor housing on the substrate for substantially encompassing the sensor chip, the sensor housing having a through-hole cavity defining an optical glass (IR filter) seat, the sensor housing defining an upper surface and an edge surface thereof; an optical glass (IR filter) on the optical glass (IR filter) seat; an encapsulation material for substantially encapsulating the upper surface and edge surface of the sensor housing, a corresponding surface of the substrate adjacent the edge surface of the sensor housing, and the side edge of the optical glass (IR filter); wherein the sensor housing is provided with a gas-exit allowing possible high temperature gas to exit; the encapsulation material forms an upper surface which is substantially aligned with a top surface of the optical glass (IR filter); the encapsulation material forms an u

Abstract: An image sensor module with a protection layer and a method for manufacturing the same includes a substrate with an upper surface and a lower surface, a chip is mounted on the upper surface of the substrate, a plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate, a adhered layer is coated on the upper surface of the substrate, a lens holder has a lateral wall, a protection layer and internal thread, the lateral wall is adhered on the upper surface of the substrate by the adhered layer to encapsulate the chip, so that the protection layer is located on adjacent the sensor region of the chip to prevent adhered layer flowed to the sensor region of the chip; and a lens barrel is formed with external thread screwed on the internal thread of the lens holder.

Abstract: An image sensor package structure includes a substrate, a chip, a plurality of wires, and a frame layer. The substrate has an upper surface, which is formed with first electrodes, and a lower surface, which is formed with second electrodes corresponding to electrically connect to the first electrodes. The chip has a sensor region and a plurality of bonding pads located at the side of the sensor region of the chip, and is mounted on the upper surface of the substrate. The plurality of wires are electrically connected the bonding pads of the chip to the first electrodes of the substrate. The frame layer is inserted with a transparent layer, and is arranged on the upper surface of the substrate to cover the chip.

Abstract: An image sensor module with air escape hole includes a substrate having an upper surface and a lower surface. A chip is mounted on the upper surface of the substrate. A plurality of wires are electrically connected the chip to the upper surface of the substrate. An adhered layer is coated on the upper surface of the substrate. A lens holder is mounted on the upper surface of the substrate by the adhered glue, and formed with a top wall, a lateral wall, and an internal thread, wherein the top wall is formed with an air escape hole. A lens barrel is formed with an external thread screwed on the internal thread of the lens holder. And a filled glue is filled within the air escape hole of the lens holder.

Abstract: A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.

Abstract: An image sensor module includes a substrate, a frame layer, a photosensitive chip, a transparent layer and a lens barrel. The substrate has a plurality of lead frame arranged in a matrix to form an upper surface, which is formed with a opening, and a lower surface, which is formed with a cavity penetrated from the opening. The frame layer is integrally formed with the substrate, and arranged at the periphery of the upper surface of the substrate to define a chamber together with the substrate, an internal thread being formed on the inner wall of the chamber. The photosensitive chip is mounted within the cavity of the substrate, and electrically coupled each of the lead frames in a flip chip manner. The transparent layer is covered onto the upper surface of the substrate to cover the opening.

Abstract: A package structure of an image sensor module for electrically connecting to a printed circuit board includes a transparent layer, an image sensing chip, a lens holder and a lens barrel. A plurality of signal input terminals and signal output terminals are formed on the transparent layer. The electrical circuits are formed on the image sensing chip, each of the electrical circuits is formed with bonding pads and is electrically connected to the transparent layer by way of flip chip bonding. A lens holder is formed with a through hole, an internal thread is formed on an inner wall of the through hole. The lens holder is mounted to the upper surface of the transparent layer. A lens barrel is arranged within the through hole of the lens holder and is formed with an external thread, which is screwed to the internal thread of the lens holder, the lens barrel is formed with a chamber and an opening communicating with the chamber.

Abstract: A method for packaging an image sensor includes the steps of: providing a substrate having an upper surface and a lower surface; mounting a frame layer to the upper surface of the substrate to form a chamber together with the substrate; mounting a photosensitive chip to the upper surface of the substrate and within the chamber, and electrically connecting the photosensitive chip to the substrate; mounting a transparent layer to the frame layer with a B-stage adhesive applied therebetween; pre-baking the B-stage adhesive to slightly adhere the transparent layer to the frame layer; testing the image sensor to determine whether the image sensor is passed or failed; and post-baking the passed image sensor to completely cure the B-stage adhesive so that the transparent layer is firmly adhered to the frame layer.

Abstract: An image sensor module includes a lens holder, a lens barrel, and an image sensor. The lens holder has an upper end face, a lower end face and an opening penetrating through the lens holder from the upper end face to the lower end face. The lower end face is formed with a first engagement portion. The lens barrel is inserted from the upper end face of the lens holder and received within the opening. The image sensor has a first surface and a second surface opposite to the first surface on which a transparent layer is arranged. A second engagement portion is formed on the first surface out of a periphery of the transparent layer. The second engagement portion engages with the first engagement portion of the lens holder to fix the image sensor to the lower end face of the lens holder.

Abstract: An image sensor module includes a lens barrel and an image sensor. The lens barrel has an upper end face, a lower end face, an external thread formed between the upper end face and the lower end face, and a transparent region formed within the lens barrel. The image sensor has a first end portion and a second end portion. A transparent layer is provided at the first end portion. An internal thread is formed above the first end portion of the image sensor to engage with the external thread of the lens barrel. Optical signals may pass through the transparent region of the lens barrel and travel to the transparent layer.

Abstract: A packaging structure of an image sensor includes a substrate, an image sensing chip, a plurality of wirings, and a transparent layer. The substrate includes a plurality of metal sheets, glue for sealing the metal sheets, a first surface, and a second surface. The metal sheets are exposed to the outside via the first surface and the second surface to form first contacts and second contacts, respectively. The image sensing chip is mounted on the substrate. The plurality of bonding pads are formed on the image sensing chip. The plurality of wirings electrically connect the bonding pads on the image sensing chip to the first contacts of the first surface of the substrate, in order to electrically connect the image sensing chip to the substrate. The transparent layer is arranged above the image sensing chip. Therefore, a packaging structure of an image sensor made of plastic materials can be formed, thereby simplifying the packaging processes and lowering the manufacturing costs.

Abstract: A modularized image sensor includes a flexible/hard combination board, signal input terminals, electrical devices, a photosensitive chip and a transparent layer. The combination board has a first surface, a second surface and an opening. The signal input terminals are formed at a periphery of the opening. The electrical devices are mounted on the combination board. The photosensitive chip has a plurality of bonding pads and a photosensitive region. The photosensitive chip is mounted on the first surface with the photosensitive region exposed from the opening. The bonding pads are electrically connected to the signal input terminals. The transparent layer is mounted on the second surface and positioned above the opening, so that the photosensitive region may receive optical signals passing through the transparent layer. Accordingly, the overall volume of the modularized image sensor may be effectively reduced, and the manufacturing processes may be simplified.

Abstract: An image sensor includes a substrate, a frame layer, a photosensitive chip and a transparent layer. The substrate is composed of spaced metal sheets. Each metal sheet includes a first board, a second board and a third board connecting the first and second boards, which are located at different heights. The frame layer has an upper surface and a lower surface. The frame layer covers and seals the metal sheets while exposes bottom surfaces of the second boards. The frame layer is formed with a chamber. Bottom surfaces of the first boards are exposed through the chamber, and a transparent region communicating with the chamber is formed on the upper surface of the frame layer. The photosensitive chip formed with bonding pads is disposed within the chamber. The bonding pads contact the bottom surfaces of the first boards. The transparent layer is mounted on the frame layer.

Abstract: A package structure of an image sensor is characterized in that an image sensing chip is directly packaged on a flexible circuit board by way of flip chip bonding. The package structure of an image sensor includes an image sensing chip, a flexible circuit board, and a transparent layer. A plurality of electrical circuits are formed on the image sensing chip. Each of the electrical circuits is formed with bonding pads. A flexible circuit board has an upper surface and a lower surface. Signal input terminals are formed on the lower surface and at positions corresponding to each of the bonding pads of the image sensing chip, respectively, for electrically connecting to the corresponding bonding pads of the image sensing chip. The signal input terminals are electrically connected to signal output terminals, respectively, for electrically connecting to the printed circuit board. The transparent layer is used for covering the upper surface of the flexible circuit board.