Patents by Inventor Hsiu-Wen WU

Hsiu-Wen WU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20250022668
    Abstract: A multilayer polymer capacitor (MLPC), including a casing, a multilayer core, an electroplated positive terminal, a first electroplated negative terminal, and a second electroplated negative terminal. The casing includes a casing body and a cover plate. The casing body is provided with an accommodating cavity, whose bottom is provided with a through hole. The multilayer core is provided in the accommodating cavity. An anode lead-out part and a cathode lead-out part are provided at two ends of the accommodating cavity, respectively. The electroplated positive terminal and the first electroplated negative terminal are provided on outer side surfaces of two ends of the casing, respectively. The second electroplated negative terminal is provided on an outer bottom surface of the casing, and is electrically connected to the multilayer core.
    Type: Application
    Filed: September 29, 2024
    Publication date: January 16, 2025
    Inventors: CHENG-YI YANG, I-CHU LIN, YUAN-YU LIN, CHIN-TSUN LIN, Qirui CHEN, HSIU-WEN WU
  • Publication number: 20240387521
    Abstract: A semiconductor device includes a substrate including a well region of a first conductive type; a first gate electrode on the substrate; a second gate electrode on the substrate; a first doped region embedded within the well region and is of the first conductive type, a second doped region embedded within the well region and is of the first conductive type, and a third doped region embedded within the well region and is of the first conductive type; and a first interconnection structure electrically connecting the first gate electrode and the second gate electrode. The first doped region and the second doped region are on opposite sides of the first gate electrode.
    Type: Application
    Filed: July 30, 2024
    Publication date: November 21, 2024
    Inventors: Ho-Hsiang CHEN, Chi-Hsien LIN, Ying-Ta LU, Hsien-Yuan LIAO, Hsiu-Wen WU, Chiao-Han LEE, Tzu-Jin YEH
  • Publication number: 20230378169
    Abstract: The present disclosure provides a semiconductor device and a method of manufacturing a semiconductor device. The semiconductor device comprises a substrate, a first gate electrode, a second gate electrode, a first doped region, a second doped region, a third doped region, and a first interconnection structure. The substrate comprises a well region of a first conductive type. The first and second gate electrodes are disposed on the substrate. The first, second, and third doped regions are embedded within the well region and are of the first conductive type. The first interconnection structure electrically connects the first gate electrode and the second gate electrode. The first doped region and the second doped region are disposed on opposite sides of the first gate electrode.
    Type: Application
    Filed: May 18, 2022
    Publication date: November 23, 2023
    Inventors: HO-HSIANG CHEN, CHI-HSIEN LIN, YING-TA LU, HSIEN-YUAN LIAO, HSIU-WEN WU, CHIAO-HAN LEE, TZU-JIN YEH
  • Publication number: 20230282644
    Abstract: A cell layout design for an integrated circuit. In one embodiment, the integrated circuit includes a dual-gate cell forming two transistors connected with each other via a common source/drain terminal. The dual-gate cell includes an active region, two gate lines extending across the active region, at least one first gate via disposed on one or both of the two gate lines and overlapped with the active region, and second gate vias disposed on one or both of the two gate lines and located outside the active region.
    Type: Application
    Filed: June 30, 2022
    Publication date: September 7, 2023
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Ho-Hsiang CHEN, Chi-Hsien LIN, Ying-Ta LU, Hsien-Yuan LIAO, Hsiu-Wen WU, Chiao-Han LEE, Tzu-Jin YEH