Abstract: A connector includes a housing having top and bottom faces. The housing defines an array of cells and each cell has an opening in the top face and a closed bottom with a slit defined in the bottom and exposed to the bottom face of the housing. A bump is formed on the bottom face next to each slit. A conductive terminal made by a first forming operation carried out on a metal plate is received in each cell through the top opening. The terminal has a base section positioned in the cell and a solder pad connected to the base section by a neck portion. The base section, the solder pad and the neck portion are substantially coplanar. The solder pad and the neck portion extend through the slit and beyond the bottom face of the housing. A second forming operation is carried out on the neck portions of all the terminals to bend all the neck portions about the bumps whereby the solder pads are substantially parallel to the bottom face.