Patents by Inventor Hslng-Hung Hsieh

Hslng-Hung Hsieh has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Coated Metal Alloy Substrate with at least one Chamfered Edge and Process for Production Thereof
    Publication number: 20220162766
    Abstract: A coated metal alloy substrate with at least one chamfered edge, a process for producing a coated metal alloy substrate, and an electronic device having a housing comprising a coated metal alloy substrate are described. The coated metal alloy substrate with at least 10 one chamfered edge comprises a water transfer print layer deposited on the metal alloy substrate, a passivation layer deposited on the at least one chamfered edge, and an electrophoretic deposition layer deposited on the passivation layer.
    Type: Application
    Filed: August 14, 2019
    Publication date: May 26, 2022
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Kuan-Ting Wu, Chi Hao Chang, Hslng-Hung Hsieh