Abstract: An electronic device includes a metal back cover, a metal frame, and a first, second, third, and fourth radiators. The metal frame includes a discrete part and two connection parts. The connection parts are located by two sides of the discrete part, separated from the discrete part, and connected to the metal back cover. A U-shaped slot is formed between the discrete part and the metal back cover and between the discrete part and the connection parts. The first radiator is separated from the discrete part and includes a feed end. The second, third, and fourth radiators are connected to the discrete part and the metal back cover. The third radiator is located between the first and second radiators. The first radiator is located between the third and fourth radiators. The discrete part and the first, second, third, and fourth radiators form an antenna module together.

Abstract: An electronic device including a metal back cover, a metal frame, a first radiator and a second radiator is provided. The metal frame includes a disconnected part and two connecting parts, the two connecting parts are located at two sides of the disconnected part, separated from the disconnected part and connected to the metal back cover. A U-shaped slot is formed between the disconnected part and the metal back cover, and between the disconnected part and the two connecting parts. The first radiator is located beside the disconnected part and includes a feeding end and a first connecting end away from the feeding end, and the first connecting end is connected to the disconnected part. The second radiator is located beside the disconnected part, and includes a ground end and a second connecting end opposite to each other. The ground end is connected to the metal back cover.

Abstract: The present disclosure provides an electronic device. The electronic device includes a first electronic component and a second electronic component. The first electronic component is configured to receive a radio frequency (RF) signal and amplify a power of the RF signal. The second electronic component is disposed under the first electronic component. The second electronic component includes an interconnection structure passing through the second electronic component. The interconnection structure is configured to provide a path for a transmission of the RF signal.

Abstract: An electronic device, including a metal back cover, a ground radiator, a third radiator, and a metal frame including a first cutting opening, a second cutting opening, a first radiator located between the first cutting opening and the second cutting opening, and a second radiator located beside the second cutting opening and separated from the first radiator by the second cutting opening, is provided. An end of a first slot formed between the metal back cover and a first part of the first radiator is communicated with the first cutting opening, and a second slot formed between the metal back cover and a second part of the first radiator and between the metal back cover and the second radiator is communicated with the second cutting opening. The ground radiator connects the metal back cover and the first radiator and separates the first slot from the second slot.

Abstract: This disclosure provides improved processes for converting benzene/toluene via methylation with methanol/dimethyl ether for producing, e.g., p-xylene. In an embodiment, a process utilizes a methylation catalyst system comprising a molecular sieve catalyst and an auxiliary catalyst. The auxiliary catalyst comprises a metal element selected from Group 2, Group 3, the lanthanide series, the actinide series, and mixtures and combinations thereof. The auxiliary catalyst may comprise the oxide of the metal element. Deactivation of the molecular sieve catalyst can be reduced with the inclusion of the auxiliary catalyst in the methylation catalyst system.

Abstract: An electronic device including a metal housing, a first antenna module, and a second antenna module is disclosed. The metal housing includes a back cover and a frame, the frame is located on a side of the back cover, and a slot is arranged between the back cover and the frame. The frame includes two slits and a segment, and the two slits are connected with the slot to form a U shape. The segment is surrounded by the two slits and the slot. The first antenna module includes an antenna radiator formed by the segment. The antenna radiator is coupled to the back cover across the slot through multiple connecting portions. The second antenna module is disposed on the connecting portions to be coupled to the back cover and grounded, and an antenna coupling gap exists between the second antenna module and the frame.

Abstract: An electronic package is provided. The electronic package includes an amplifier component, a control component, and a first circuit layer. The control component is disposed above the amplifier component. The first circuit layer is disposed between the amplifier component and the control component. The control component is configured to transmit a first signal to the amplifier component and to output a second signal amplified by the amplifier component.

Abstract: A package structure includes an encapsulant, a patterned circuit structure, at least one electronic component and a shrinkage modifier. The patterned circuit structure is disposed on the encapsulant and includes a pad. The electronic component is disposed on the patterned circuit structure, and includes a bump electrically connected to the pad. The shrinkage modifier is encapsulated in the encapsulant and configured to reduce a relative displacement between the bump and the pad along a horizontal direction in an environment of temperature variation.

Abstract: This disclosure provides an improved process for converting benzene/toluene via methylation with methanol/dimethyl ether for producing, e.g., p-xylene, comprising separating and recycling dimethyl ether from the methylation reaction product mixture effluent to the methylation reactor. High selectivity toward p-xylene, among others, can be achieved.

Abstract: This disclosure provides improved processes for converting benzene/toluene via methylation with methanol/dimethyl ether for producing, e.g., p-xylene. In an embodiment, a process comprises contacting a methylation agent feed with an aromatic hydrocarbon feed in the presence of a methylation catalyst in a methylation reactor at increased pressure. Reduced methylation catalyst deactivation can be achieved with increased pressure in the methylation reactor.

Abstract: This disclosure provides improved processes for converting aromatic hydrocarbons, such as benzene/toluene, alkylation, transalkylation, or isomerization. In an embodiment, a process comprises utilizing a passivated reactor to reduce deactivation of a molecular sieve catalyst. Additional measures such as the use of an auxiliary catalyst and/or an elevated reactor pressure may be used to further reduce deactivation of the molecular sieve catalyst.

Abstract: A method of forming a semiconductor structure includes following steps. A semiconductor material structure is formed over a substrate. A first pad layer is formed over the semiconductor material structure. The first pad layer and the semiconductor material structure are etched to form a trench. An oxidation process is performed on a sidewall of the semiconductor material structure to form a first oxide structure on the sidewall of the semiconductor material structure. A second oxide structure is formed in the trench.

Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.

Abstract: A method of forming a semiconductor structure includes following steps. A semiconductor material structure is formed over a substrate. A first pad layer is formed over the semiconductor material structure. The first pad layer and the semiconductor material structure are etched to form a trench. An oxidation process is performed on a sidewall of the semiconductor material structure to form a first oxide structure on the sidewall of the semiconductor material structure. A second oxide structure is formed in the trench.

Abstract: This invention relates to polymers comprising: one or more that include 1) at least 11 wt % 4 substituted 1,4 hexadiene and less than 20 wt % 5-methyl-1,4-hexadiene, based upon the weight of the polymer, and 2) optionally, one or more olefins; and processes to produces such polymers using metallocene or post-metallocene catalyst compounds.

Abstract: A semiconductor device package includes an electronic component, an electrical contact and a reinforcement layer. The electronic component has a first conductive layer on a first surface of the electronic component. The electronic component has a through-silicon-via (TSV) penetrating the electronic component and electrically connected to the first conductive layer. The electrical contact is disposed on the first surface of the electronic component and electrically connected to the first conductive layer. The reinforcement layer is disposed on the first surface of the electronic component.

Abstract: A semiconductor package structure and method for manufacturing the same are provided. The semiconductor package structure includes a first electronic component, a conductive pillar, a second electronic component, and a conductive through via. The conductive pillar is disposed on the first electronic component and has a first surface facing away from the first electronic component. The second electronic component is disposed on the first electronic component. The conductive through via extends through the second electronic component and has a first surface facing away from the first electronic component. The first surface of the conductive through via and the first surface of the conductive pillar are substantially coplanar.

Abstract: This disclosure provides improved processes for converting benzene/toluene via methylation with methanol/dimethyl ether for producing, e.g., p-xylene. In an embodiment, a process comprises contacting a methylation agent feed with an aromatic hydrocarbon feed in the presence of a methylation catalyst in a methylation reactor at increased pressure. Reduced methylation catalyst deactivation can be achieved with increased pressure in the methylation reactor.

Abstract: This disclosure provides an improved process for converting benzene/toluene via methylation with methanol/dimethyl ether for producing, e.g., p-xylene, comprising separating and recycling dimethyl ether from the methylation reaction product mixture effluent to the methylation reactor. High selectivity toward p-xylene, among others, can be achieved.

Abstract: The invention provides an identity authentication system and a method thereof. Embodiments of the invention provide application, installation, and verification processes of a mobile identification card, and enable a mobile apparatus of a user to be a carrier of the mobile identification card. The mobile identification card can be applied to services related to internal identification of enterprises, groups, or government agencies, and achieve smart and mobile identification. The mobile identification card is provided via an over-the-air mechanism. A mobile enterprise identification card service is provided to one or more enterprises by using a gateway. In addition, in combination with advantages of a dynamic graphics coding technology, a geographic location, data encryption with a key, transaction time recording, and other technologies, a graphic code can be generated for identity authentication. Therefore, highly secure identity authentication can be provided by using a dynamic graphic code.