Patents by Inventor Hsu-Hsien Chen

Hsu-Hsien Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHODS AND APPARATUS FOR FORMING PACKAGE-ON-PACKAGES
    Publication number: 20140185264
    Abstract: Methods and apparatus are disclosed for a package or a package-on-package (PoP) device. An IC package or a PoP device may comprise an electrical path connecting a die and a decoupling capacitor, wherein the electrical path may have a width in a range from about 8 um to about 44 um and a length in a range from about 10 um to about 650 um. The decoupling capacitor and the die may be contained in a same package, or at different packages within a PoP device, connected by contact pads, redistribution layers (RDLs), and connectors.
    Type: Application
    Filed: December 28, 2012
    Publication date: July 3, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsu-Hsien Chen, Chih-Hua Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen
  • Package Structures Including a Capacitor and Methods of Forming the Same
    Publication number: 20140127866
    Abstract: A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side.
    Type: Application
    Filed: January 13, 2014
    Publication date: May 8, 2014
    Applicant: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen, Chen-Shien Chen
  • POP Structures and Methods of Forming the Same
    Publication number: 20140103488
    Abstract: A device includes a top package bonded to a bottom package. The bottom package includes a molding material, a device die molded in the molding material, a Through Assembly Via (TAV) penetrating through the molding material, and a redistribution line over the device die. The top package includes a discrete passive device packaged therein. The discrete passive device is electrically coupled to the redistribution line.
    Type: Application
    Filed: October 11, 2012
    Publication date: April 17, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Hsu-Hsien Chen, Chih-Hua Chen, En-Hsiang Yeh, Monsen Liu, Chen-Shien Chen
  • Package structures including a capacitor and methods of forming the same
    Patent number: 8653626
    Abstract: A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side.
    Type: Grant
    Filed: July 18, 2012
    Date of Patent: February 18, 2014
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen, Chen-Shien Chen
  • PACKAGE STRUCTURES INCLUDING A CAPACITOR AND METHODS OF FORMING THE SAME
    Publication number: 20140021583
    Abstract: A package includes a die, an encapsulant, and a capacitor. The package has a package first side and a package second side. The die has a die first side corresponding to the package first side, and has a die second side corresponding to the package second side. The die first side is opposite the die second side. The encapsulant surrounds the die. The capacitor includes a first plate and a second plate in the encapsulant, and opposing surfaces of the first plate and the second plate extend in a direction from the package first side to the package second side. The external conductive connectors are attached to at least one of the package first side and the package second side.
    Type: Application
    Filed: July 18, 2012
    Publication date: January 23, 2014
    Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sut-I Lo, Ching-Wen Hsiao, Hsu-Hsien Chen, Chen-Shien Chen