Patents by Inventor Hsu Jen Jung

Hsu Jen Jung has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Structure of circuit boards for wireless communication apparatus
    Publication number: 20040136335
    Abstract: The present invention reveals a structure of circuit boards for a wireless communication apparatus to increase product yield and throughput. The structure of circuit boards includes an RF module and a second circuit board, the RF module including a first circuit board and at least one RF device equipped on the first circuit board, the area of the second circuit board being no smaller than that of the first circuit board, and the first circuit board being disposed on the surface of the second circuit board.
    Type: Application
    Filed: April 11, 2003
    Publication date: July 15, 2004
    Applicant: Abocom Systems Inc.
    Inventors: Eric Oh-Yang, Hsu Jen Jung