Abstract: A light adjustable AC (alternating-current) LED device is provided. A color temperature of the light adjustable AC LED device is decreased as decreased brightness thereof. The light adjustable AC LED device includes an AC power source, a plurality of power loops and a plurality of LED segments. The AC power source is for providing an AC voltage. Each of the power loops is electrically connected with the AC power source, and each of the LED segments is electrically connected with each power loop. When the AC voltage is gradually raised, each LED segment of each power loop is turned-on in sequence, thereby a color temperature of each LED segment being mixed in sequence; when the AC voltage is gradually dropped, each LED segment of each power loop is turned-off in reverse order.

Abstract: The illuminating device of the invention comprises at least one lighting component, red lighting component, current limiting component and fluorescent body, wherein said red lighting component is first series connected with said current limiting component, and further parallel connected with said lighting component, so that input current to red lighting component is controlled by said current limiting component to be smaller than input current to lighting component, thereby said fluorescent body receiving and triggering the light emitted by said lighting component is mixed with the light emitted by said red lighting device to emit a white light with high lighting efficient and high color rendering white light.

Abstract: The illuminating device of the invention comprises at least one lighting component, red lighting component, current limiting component and fluorescent body, wherein said red lighting component is first series connected with said current limiting component, and further parallel connected with said lighting component, so that input current to red lighting component is controlled by said current limiting component to be smaller than input current to lighting component, thereby said fluorescent body receiving and triggering the light emitted by said lighting component is mixed with the light emitted by said red lighting device to emit a white light with high lighting efficient and high color rendering white light.

Abstract: A light emitting diode device includes a substrate, a reflector cup, a light emitting diode chip, and a phosphor paste. The reflector cup is set on the substrate, and has a wall of a first length and a first height wherein the first length is defined by a corresponding inner edge thereof. The LED chip is mounted on the substrate, and comprises a second length and a second height. The phosphor paste covers on the LED chip. The first height of the wall and the second height of the LED chip has a first ratio, and the first length of the wall and the second length of the LED chip has a second ratio wherein the first ratio is larger than the second ratio.

Abstract: A light emitting diode (LED) includes a LED chip, which can transfer electrical power to electric-magnetic wave. A set of lead frame is enclosed by electrical isolator material to form a cavity. An optics lens seats on top of the cavity and is bonded to said electrical isolator material. A submount to carry said LED chip is soldered or adhered to the lead frame and forms the electrical contact from said LED chip to lead frame. A high transparency material is utilized to enclosed the LED chip.

Abstract: A light emitting diode (LED) includes a LED chip, which can transfer electrical power to electric-magnetic wave. A set of lead frame is enclosed by electrical isolator material to form a cavity. An optics lens seats on top of the cavity and is bonded to said electrical isolator material. A submount to carry said LED chip is soldered or adhered to the lead frame and forms the electrical contact from said LED chip to lead frame. A high transparency material is utilized to enclosed the LED chip.

Abstract: A photoelectric module device comprising a multiple layer printed circuit board and at least one photoelectric module device is provided. The multiple layer printed circuit board has at least an upper circuit board substrate, a lower circuit board substrate, and a circuit. A plurality of photoelectric elements are installed on the multiple layer printed circuit board and is electrically connected to the circuit. The photoelectric elements are packaged above the multiple layer printed circuit board by injection molding a transparent resin thereon. The lower substrate has a plurality of through holes formed therein and the inner wall of the through holes is plated with metal, as an electric terminal. The upper circuit board substrate serves to seal the through holes and prevent resin from permeating therein during the injection molding process.