Patents by Inventor Hsu-Liang Hsiao

Hsu-Liang Hsiao has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Patent number: 10177268
    Abstract: An optical device includes: (1) an emitter; (2) a detector disposed adjacent to the emitter; (3) an encapsulation layer encapsulating the emitter and the detector; (4) a dielectric layer disposed on the emitter, the detector and the encapsulation layer; (5) a redistribution layer disposed on the dielectric layer and electrically connected to the emitter and the detector; and (6) a light shielding structure disposed on the encapsulation layer and corresponding to a location between the emitter and the detector.
    Type: Grant
    Filed: January 12, 2018
    Date of Patent: January 8, 2019
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ying-Chung Chen, Hsu-Liang Hsiao, Sung-Fu Yang
  • Publication number: 20180334380
    Abstract: At least some embodiments of the present disclosure relate to a semiconductor device package. The semiconductor device package includes a substrate with a first groove and a semiconductor device. The first groove has a first portion, a second portion, and a third portion, and the second portion is between the first portion and the third portion. The semiconductor device includes a membrane and is disposed on the second portion of the first groove. The semiconductor device has a first surface adjacent to the substrate and opposite to the membrane. The membrane is exposed by the first surface.
    Type: Application
    Filed: May 18, 2017
    Publication date: November 22, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsu-Liang HSIAO, Lu-Ming LAI, Ching-Han HUANG, Chia-Hung SHEN
  • Publication number: 20180213312
    Abstract: A microelectromechanical systems package structure includes a first substrate, a transducer unit, a semiconductor chip and a second substrate. The first substrate defines a through hole. The transducer unit is electrically connected to the first substrate, and includes a base and a membrane. The membrane is located between the through hole and the base. The semiconductor chip is electrically connected to the first substrate and the transducer unit. The second substrate is attached to the first substrate and defines a cavity. The transducer unit and the chip are disposed in the cavity, and the second substrate is electrically connected to the transducer unit and the semiconductor chip through the first substrate.
    Type: Application
    Filed: January 24, 2018
    Publication date: July 26, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsu-Liang Hsiao, Yu-Hsuan Tsai, Pu Shan Huang, Ching-Han Huang, Lu-Ming Lai
  • Publication number: 20180182913
    Abstract: An optical device includes: (1) an emitter; (2) a detector disposed adjacent to the emitter; (3) an encapsulation layer encapsulating the emitter and the detector; (4) a dielectric layer disposed on the emitter, the detector and the encapsulation layer; (5) a redistribution layer disposed on the dielectric layer and electrically connected to the emitter and the detector; and (6) a light shielding structure disposed on the encapsulation layer and corresponding to a location between the emitter and the detector.
    Type: Application
    Filed: January 12, 2018
    Publication date: June 28, 2018
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ying-Chung CHEN, Hsu-Liang HSIAO, Sung-Fu YANG
  • Patent number: 9923103
    Abstract: A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.
    Type: Grant
    Filed: May 20, 2015
    Date of Patent: March 20, 2018
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 9905722
    Abstract: An optical module structure includes a light source, a light receiver, a dielectric layer, a circuit layer, an encapsulant and a light shielding structure. The light source is embedded in the encapsulant, and a first surface of the light source is exposed from a first surface of the encapsulant. The light receiver is embedded in the encapsulant, and a first surface of the light receiver is exposed from the first surface of the encapsulant. The dielectric layer is disposed on the first surface of the encapsulant. The circuit layer is disposed on the dielectric layer and electrically connected to the light source and the light receiver. The light shielding structure is disposed in the dielectric layer corresponding to a location between the light source and the light receiver.
    Type: Grant
    Filed: December 27, 2016
    Date of Patent: February 27, 2018
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ying-Chung Chen, Hsu-Liang Hsiao, Sung-Fu Yang
  • Publication number: 20150255635
    Abstract: A detachable package structure that includes an assembly substrate, a first semiconductor substrate, a second semiconductor substrate, and a combination element is provided. The first semiconductor substrate is disposed on the assembly substrate and has a first alignment portion. The second semiconductor substrate has a second alignment portion. The combination element allows the first semiconductor substrate and the second semiconductor substrate to be detachably combined together, such that the first alignment portion and the second alignment portion are aligned and combined.
    Type: Application
    Filed: May 20, 2015
    Publication date: September 10, 2015
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 9064988
    Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.
    Type: Grant
    Filed: December 20, 2012
    Date of Patent: June 23, 2015
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 8666204
    Abstract: An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: March 4, 2014
    Assignee: National Central University
    Inventors: Mao-Jen Wu, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Patent number: 8644654
    Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: February 4, 2014
    Assignee: National Central University
    Inventors: Mao-Jen Wu, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Publication number: 20130309801
    Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.
    Type: Application
    Filed: May 15, 2012
    Publication date: November 21, 2013
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
  • Patent number: 8588559
    Abstract: An optical coupler module includes a semiconductor substrate disposed on the print circuit board; a reflecting trench structure formed on the semiconductor substrate; a reflector formed on a slant surface of the reflecting trench structure; a strip trench structure formed on the semiconductor substrate and connecting with the reflecting trench structure; a thin film disposed on the above-mentioned structure. The optical coupler module further includes a signal conversion unit disposed on the semiconductor substrate and the position of the signal conversion unit corresponds to the reflector; and an optical waveguide structure formed in the trench structures. The optical signal from the signal conversion unit is reflected by the reflector and then transmitted in the optical waveguide structure, or in a reverse direction to reach the signal conversion unit.
    Type: Grant
    Filed: September 6, 2011
    Date of Patent: November 19, 2013
    Assignee: National Central University
    Inventors: Mao-Jen Wu, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Patent number: 8580589
    Abstract: A wafer-level process for fabricating a plurality of photoelectric modules is provided. The wafer-level process includes at least following procedures. Firstly, a wafer including a plurality of chips arranged in an array is provided. Next, a plurality of photoelectric devices are mounted on the chips. Next, a cover plate including a plurality of covering units arranged in an array is provided. Next, a plurality of light guiding mediums are formed over the cover plate. Next, the cover plate is bonded with the wafer by an adhesive, wherein each of the covering units covers and bonds with one of the chips, and the light guiding mediums are sandwiched between the cover plate and the wafer. Then, the wafer and the cover plate are diced to obtain the plurality of photoelectric modules.
    Type: Grant
    Filed: May 15, 2012
    Date of Patent: November 12, 2013
    Assignee: Centera Photonics Inc.
    Inventors: Hsu-Liang Hsiao, Chun-Chiang Yen, Guan-Fu Lu
  • Publication number: 20130270427
    Abstract: A photoelectric device package and a detachable package structure are provided. The photoelectric device package includes a bottom-plate, a top-plate, at least one photoelectric device, and at least one light-guiding element. The bottom-plate has a first carrying part and a first substrate part on the first carrying part. The first carrying part has first alignment portions. The first substrate part has second alignment portions. The top-plate has a second carrying part and a second substrate part on the second carrying part. The second carrying part has third alignment portions. The second substrate part has fourth alignment portions. The top-plate and the bottom-plate are assembled by the first and third alignment portions. The first and second substrate parts are positioned by the second and fourth alignment portions. Each photoelectric device is disposed on the first substrate part. Each light-guiding element is disposed between the first and second substrate parts.
    Type: Application
    Filed: December 20, 2012
    Publication date: October 17, 2013
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Hsu-Liang Hsiao, Guan-Fu Lu, Tzu-Ching Yeh, Chun-Chiang Yen
  • Patent number: 8503835
    Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.
    Type: Grant
    Filed: May 24, 2011
    Date of Patent: August 6, 2013
    Assignee: National Central University
    Inventors: Mao-Jen Wu, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Publication number: 20120241600
    Abstract: An optical electrical module includes a first substrate, a second substrate, a bearing portion and at least one optical electrical element. The second substrate is combined with the first substrate and has a reflective surface facing to the first substrate. The bearing portion is disposed between the first substrate and the second substrate to limit at least one light guide element. The optical electrical element is disposed on a surface of the first substrate facing to the reflective surface and faces to the reflective surface. The optical electrical element is configured for providing or receiving light signals. The reflective surface and the light guide element are disposed on an optical path of the light signals.
    Type: Application
    Filed: March 18, 2012
    Publication date: September 27, 2012
    Applicant: CENTERA PHOTONICS INC.
    Inventors: Yun-Chih Lee, Chang-Feng Lu, Chun-Chiang Yen, Shang-Jen Yu, Hsu-Liang Hsiao
  • Publication number: 20120057822
    Abstract: An optical coupler module includes a semiconductor substrate disposed on the print circuit board; a reflecting trench structure formed on the semiconductor substrate; a reflector formed on a slant surface of the reflecting trench structure; a strip trench structure formed on the semiconductor substrate and connecting with the reflecting trench structure; a thin film disposed on the above-mentioned structure. The optical coupler module further includes a signal conversion unit disposed on the semiconductor substrate and the position of the signal conversion unit corresponds to the reflector; and an optical waveguide structure formed in the trench structures. The optical signal from the signal conversion unit is reflected by the reflector and then transmitted in the optical waveguide structure, or in a reverse direction to reach the signal conversion unit.
    Type: Application
    Filed: September 6, 2011
    Publication date: March 8, 2012
    Applicant: National Central University
    Inventors: Mao-Jen WU, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Publication number: 20110286695
    Abstract: The optical coupler module for converting and transmitting electrical/optical signals includes a semiconductor substrate, a first film, a second film, an electrical transmission unit, at least one signal conversion unit and an optical waveguide structure. The first film and the second film are formed on opposite surfaces of the semiconductor substrate. The signal conversion unit and the optical waveguide structure are disposed on opposite sides of the semiconductor substrate. The optical waveguide structure has a reflector and a waveguide body. The optical signal generated from the signal conversion unit sequentially passes the first film, the semiconductor substrate and the second film and enters the optical waveguide structure. Then, the optical signal is reflected by the reflector and transmitted in the waveguide body to be outputted. Alternatively, the optical signal is transmitted in a reverse direction from the optical waveguide structure to the signal conversion unit.
    Type: Application
    Filed: May 24, 2011
    Publication date: November 24, 2011
    Applicant: National Central University
    Inventors: Mao-Jen WU, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Publication number: 20110286694
    Abstract: An optical transmission module includes a semiconductor substrate, a first film layer, an electronic component layer and a waveguide structure. The electronic component layer is used for converting a first electrical signal into an optical signal. The waveguide structure is formed on the first film layer, and includes a first reflective surface, a waveguide body and a second reflective surface. After the optical signal is transmitted through the semiconductor substrate and the first film layer and enters the waveguide structure, the optical signal is reflected by the first reflective surface, transmitted within the waveguide body and reflected by the second reflective surface. After the optical signal reflected by the second reflective surface is transmitted through the first film layer and the semiconductor substrate and received by the electronic component layer, the optical signal is converted into a second electrical signal by the electronic component layer.
    Type: Application
    Filed: May 24, 2011
    Publication date: November 24, 2011
    Applicant: National Central University
    Inventors: Mao-Jen WU, Hsiao-Chin Lan, Yun-Chih Lee, Chia-Chi Chang, Hsu-Liang Hsiao, Chin-Ta Chen, Bo-Kuan Shen, Guan-Fu Lu, Yan-Chong Chang, Jen-Yu Chang
  • Publication number: 20110049554
    Abstract: A package base structure for packaging a light-emitting element and a related manufacturing process are provided. The package base structure includes a semiconductor substrate having a top surface, a receiving space in the top surface and defined by slant surfaces, and a micro diffractive optical element on one of the slant surfaces. To produce the package base structure, a first etching mask with a first etching window is formed on the top surface. The etching window has a sidewall oriented at a bias angle with respect to a specific equivalent crystallographic orientation of the semiconductor substrate. Then, a selective anisotropic etching procedure is performed through the first etching window to form the slant surfaces on the semiconductor substrate. Afterwards, the micro diffractive optical element is formed on the slant surface for collimating or focusing a light beam emitted from the light-emitting element.
    Type: Application
    Filed: August 27, 2010
    Publication date: March 3, 2011
    Applicant: NATIONAL CENTRAL UNIVERSITY
    Inventors: Mao-Jen Wu, Hsiao-Chin Lan, An-Nong Wen, Chih-Hung Hsu, Hsu-Liang Hsiao, Chia-Chi Chang, Chia-Yu Lee, Siou-Ping Chen, Min-Hao Chung