Patents by Inventor Hsu-Pin Wang
Hsu-Pin Wang has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 10390578Abstract: Guard padding with sensor is provided, including a cushion pad and a sensor. The cushion pad has auxetic structure and is manufactured by a 3D printing process. The cushion pad has a slot at a side thereof. The sensor manufactured by the 3D printing process is disposed in the slot. The sensor is a pressure sensor, a humidity sensor or a temperature sensor. The pressure sensor generates a pressure signal, the humidity sensor generates a humidity signal and the temperature sensor generates a temperature signal.Type: GrantFiled: June 22, 2016Date of Patent: August 27, 2019Assignee: National Tsing Hua UniversityInventors: Chia-Chen Kuo, Mao-Jiun Wang, Chun Zhang, Hsu-Pin Wang, Kan Wang
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Patent number: 10327700Abstract: An intelligent insole is provided. The intelligent insole includes an insole body, a pressure sensor, a temperature sensor, a humidity sensor and a signal collector. The pressure sensor, the temperature sensor and the humidity sensor are formed on the surface of the insole body, and the above sensors and the insole body are manufactured via the same 3D printing process. The pressure sensor senses the pressure signal from the insole body in contact with the foot. The temperature sensor and the humidity sensor respectively sense the temperature signal and the humidity signal of the insole body. The signal collector is respectively electrically connected to the pressure sensor, the temperature sensor and the humidity sensor to receive the pressure signal, the temperature signal and the humidity signal and then transmit the signals to a signal receiver via wireless transmission.Type: GrantFiled: June 29, 2016Date of Patent: June 25, 2019Assignee: National Tsing Hua UniversityInventors: Yu-Chi Lee, Mao-Jiun Wang, Chun Zhang, Hsu-Pin Wang
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Publication number: 20170273386Abstract: Guard padding with sensor is provided, including a cushion pad and a sensor. The cushion pad has auxetic structure and is manufactured by a 3D printing process. The cushion pad has a slot at a side thereof. The sensor manufactured by the 3D printing process is disposed in the slot. The sensor is a pressure sensor, a humidity sensor or a temperature sensor. The pressure sensor generates a pressure signal, the humidity sensor generates a humidity signal and the temperature sensor generates a temperature signal.Type: ApplicationFiled: June 22, 2016Publication date: September 28, 2017Inventors: CHIA-CHEN KUO, Mao-Jiun Wang, CHUN ZHANG, HSU-PIN WANG, KAN WANG
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Publication number: 20170238870Abstract: An intelligent insole is provided. The intelligent insole includes an insole body, a pressure sensor, a temperature sensor, a humidity sensor and a signal collector. The pressure sensor, the temperature sensor and the humidity sensor are formed on the surface of the insole body, and the above sensors and the insole body are manufactured via the same 3D printing process. The pressure sensor senses the pressure signal from the insole body in contact with the foot. The temperature sensor and the humidity sensor respectively sense the temperature signal and the humidity signal of the insole body. The signal collector is respectively electrically connected to the pressure sensor, the temperature sensor and the humidity sensor to receive the pressure signal, the temperature signal and the humidity signal and then transmit the signals to a signal receiver via wireless transmission.Type: ApplicationFiled: June 29, 2016Publication date: August 24, 2017Inventors: YU-CHI LEE, Mao-Jiun Wang, CHUN ZHANG, HSU-PIN WANG
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Publication number: 20150062301Abstract: A non-contact 3D human data acquisition system and method includes a depth-sensing camera used to acquire the front and back depth image data of static body of a test individual, and a human characteristic algorithmic processor electrically connected with the depth-sensing camera, so as to acquire the depth image data for subsequent processing. The human characteristic algorithmic processor includes a human depth data analysis module, a human sire measurement module, and a 3D human feature data acquisition module. The depth-sensing camera could be used to capture depth images, and the human characteristic algorithmic processor can be performed without contacting, with the human body or available in remote control. This allows one individual to rapidly and easily obtain important characteristic data of the human body, conduct 3D human body analysis, and collect important characteristic sizes, thus helping to set up statistical databases for further analysis, research, and other applications.Type: ApplicationFiled: November 8, 2013Publication date: March 5, 2015Applicant: NATIONAL TSING HUA UNIVERSITYInventors: Yueh-Ling LIN, MAO-JIUN WANG, HSU-PIN WANG
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Patent number: 7797075Abstract: A method of optimizing a flow process in resin transfer molding can include the steps of pre-infusing a vacuum-assisted resin transfer mold with a liquid. A sequence of the mold pre-infusion step is detected, from which a flow inhomogeneity adjacent the auxiliary infusion gate is determined. Such a flow inhomogeneity can include, for example, a region where air bubbles can collect, leaving a dry spot in the mold that is not adequately reached by flowing liquid or resin. A resin infusion sequence can then be created, including an opening of the auxiliary infusion gate following a passage of resin therepast to prevent the formation of dry spots.Type: GrantFiled: January 9, 2008Date of Patent: September 14, 2010Assignee: Florida State University Research Foundation, Inc.Inventors: Chun Zhang, Zhiyong Liang, Hsu-Pin Wang
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Patent number: 6488569Abstract: An apparatus for planarizing semiconductor wafers in a chemical-mechanical planarization process comprises a polishing pad, a wafer carrier, and at least one acoustic sensor for receiving acoustic emissions produced during the chemical-mechanical planarization process. The wafer carrier is positioned adjacent the polishing pad and is adapted for carrying a wafer in a manner so that the wafer engages the polishing pad. The wafer carrier and the polishing pad are moveable relative to one another in a manner to planarize the wafer. The acoustic sensor is mounted to the wafer carrier in a manner so that the sensor is in contact with the wafer. The acoustic sensor receives acoustic emissions produced during a chemical-mechanical planarization process. The received acoustic emissions are then analyzed to identify and determine surface characteristics of the wafer.Type: GrantFiled: July 19, 2000Date of Patent: December 3, 2002Assignee: Florida State UniversityInventors: Hsu-Pin Wang, Qing Liu
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Patent number: 5602761Abstract: The present invention provides an accurate machine monitoring technique based on vibration analysis. An AR parametric model is generated to characterize a normal machine condition. Subsequently, data is collected from a machine during operation. This data is fit to the AR parametric model, and an Exponentially Weighted Moving Average (EWMA) statistic is derived therefrom. The EWMA statistic is able to identify whether the machine is in a normal state ("in control") or in an abnormal state ("out of control"). Additionally, an EWMA control chart is generated that distinguishes between normal and abnormal conditions, and between different abnormal conditions. As a result, once the EWMA statistic is generated, it is compared to the EWMA chart for determination of the specific fault that is ailing the machine.Type: GrantFiled: December 30, 1993Date of Patent: February 11, 1997Assignee: Caterpillar Inc.Inventors: Julie K. Spoerre, Chang-Ching Lin, Hsu-Pin Wang
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Patent number: 5566092Abstract: The invention provides a machine fault diagnostic system to help ensure effective equipment maintenance. The major technique used for fault diagnostics is a fault diagnostic network (FDN) which is based on a modified ARTMAP neural network architecture. A hypothesis and test procedure based on fuzzy logic and physical bearing models is disclosed to operate with the FDN for detecting faults that cannot be recognized by the FDN and for analyzing complex machine conditions. The procedure described herein is able to provide accurate fault diagnosis for both one and multiple-fault conditions. Furthermore, a transputer-based parallel processing technique is used in which the FDN is implemented on a network of four T800-25 transputers.Type: GrantFiled: December 30, 1993Date of Patent: October 15, 1996Assignee: Caterpillar Inc.Inventors: Hsu-Pin Wang, Hsin-Hao Huang, Gerald M. Knapp, Chang-Ching Lin, Shui-Shun Lin, Julie K. Spoerre
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Patent number: 5566273Abstract: The present invention provides a system and method for supervised training of a neural network. A neural network architecture and training method is disclosed that is a modification of an ARTMAP architecture. The modified ARTMAP network is an efficient and robust paradigm which has the unique property of incremental supervised learning. Furthermore, the modified ARTMAP network has the capability of removing undesired knowledge that has previously been learned by the network.Type: GrantFiled: December 30, 1993Date of Patent: October 15, 1996Assignee: Caterpillar Inc.Inventors: Hsin-Hao Huang, Shui-Shun Lin, Gerald M. Knapp, Hsu-Pin Wang