Abstract: An apparatus is provided for packing semiconductor die. The apparatus will comprise the followings: Basically, a semiconductor die is sticked thereon a metal frame by a full tape which is an adhesive material, an uncovered housing is formed around the semiconductor die and around a part of the metal frame, wherein the metal frame having a metal wire connected the die below, a plurality of metal balls being connected under other parts of the metal frame. Also, some other related apparatus are provided.

Abstract: A method is provided for packing semiconductor die. The method includes the following steps: Firstly, a metal frame having a specific pattern is provided. Then, a material on the backside surface of a plurality of dice is laminated. The plurality of dice is located upon the metal frame. A metal wire is bonded to connect the plurality of dice below. Next, first molding the plurality of dice and parts of the metal frame to expose parts of the metal frame is achieved by a chemical compound to seal the plurality of dice. Then, the second individual/conformal molding the plurality of dice is carried out by the chemical compound. Next, a plurality of metal balls is placed to connect under other parts of the metal frame as an individual/conformal die package. Finally, the individual die package is punched to pack the semiconductor die.

Abstract: A method of forming a HSQFN (High Stand-off Quad Flat Non-leaded) package comprises providing a leadframe with bonding pads and die pads for receiving a die. Then, the die is attached on the die pad and bonding wires are connected between the bonding pads and the die for electrical connection. Molding process is used to encompass the die by compound from a first surface of the leadframe. Then, backside etching is used to etch the leadframe from a second surface of the leadframe to expose a lower surface of the compound, thereby separating the bonding pads and the die pads. A sigulation is applied to separate each individual package by cutting the leadframe and the compound.