Patents by Inventor Hsu-Shen Chu

Hsu-Shen Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20200259063
    Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.
    Type: Application
    Filed: April 30, 2020
    Publication date: August 13, 2020
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Jung CHIANG, Ren-Der JEAN, Hong-Ching LIN, Hsu-Shen CHU
  • Patent number: 10612854
    Abstract: A sample holder for annealing apparatus and electrically assisted annealing apparatus using the same are provided. The sample holder includes a heat conductive shell, high thermal conductive and electrical insulation blocks, first and second electrodes. The heat conductive shell includes a base frame and a top cover. The high thermal conductive and electrical insulation blocks are adjacent to the base frame and the top cover, respectively, and a sample pallet is sandwiched therebetween. Length and width of the sample pallet is smaller than that of the high thermal conductive and electrical insulation blocks. The first and the second electrodes are fixed to two sides of the sample pallet, and are connected to electrifying wire respectively. Thickness of the first and the second electrodes is smaller than that of the sample pallet, while the width of the first and the second electrodes is longer than that of the sample pallet.
    Type: Grant
    Filed: November 19, 2014
    Date of Patent: April 7, 2020
    Assignee: Industrial Technology Research Institute
    Inventors: Hsu-Shen Chu, Chien-Neng Liao, Yao-Hsiang Chen
  • Patent number: 10340435
    Abstract: A thermoelectric conversion device includes at least one thermoelectric conversion unit. The thermoelectric conversion unit includes at least one first electrode, at least one second electrode, a P-type thermoelectric material, and an N-type thermoelectric material. The first electrode includes a first fluid channel, such that the first electrode has a first hollow structure. The second electrode includes a second fluid channel, such that the second electrode has a second hollow structure. The P-type thermoelectric material is located between the first electrode and the second electrode, and the second electrode is located between the P-type thermoelectric material and the N-type thermoelectric material.
    Type: Grant
    Filed: December 30, 2015
    Date of Patent: July 2, 2019
    Assignee: Industrial Technology Research Institute
    Inventors: Hsu-Shen Chu, Cheng-Cho Wong, Chih-Hao Chang
  • Publication number: 20190189886
    Abstract: A power supplying device and a heating system are disclosed. The power supplying device includes a first base, a thermoelectric transmitting module, a conducting circuit, and a second base. The first base has a first flow path and a supporting surface. The thermoelectric transmitting module is disposed on the supporting surface. The conducting circuit is disposed on the supporting surface and electrically connected to the thermoelectric transmitting module. At least one portion of a projection of the first flow path to the supporting surface overlaps the conducting circuit. The second base is stacked on the thermoelectric transmitting module, and the thermoelectric transmitting module is positioned between the first base and the second base. The heating system includes the power supplying device and a heater powered by the power supplying device.
    Type: Application
    Filed: December 15, 2017
    Publication date: June 20, 2019
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Yion-Ni LIU, Hsu-Shen CHU, Cheng-Ting HSU
  • Publication number: 20180159014
    Abstract: A flexible thermoelectric structure is provided, which includes a porous thermoelectric pattern having a first surface and a second surface opposite to the first surface, and a polymer film covering the first surface of the porous thermoelectric pattern. The polymer film fills pores of the porous thermoelectric pattern. The polymer film has a first surface and a second surface opposite to the first surface. The second surface of the polymer film is coplanar with the second surface of the porous thermoelectric pattern.
    Type: Application
    Filed: December 29, 2016
    Publication date: June 7, 2018
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Ying-Jung CHIANG, Ren-Der JEAN, Hong-Ching LIN, Hsu-Shen CHU
  • Publication number: 20180151891
    Abstract: An anti-corrosion structure and a fuel cell employing the same are provided. The anti-corrosion structure includes an aluminum layer, a first anti-corrosion layer, and an intermediate layer disposed between the aluminum layer and the first anti-corrosion layer. In particular, the first anti-corrosion layer can be a nickel-tin-containing alloy layer, and the intermediate layer can be a nickel-tin-aluminum-containing alloy layer.
    Type: Application
    Filed: October 3, 2017
    Publication date: May 31, 2018
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Chia-Cheng HSU, Hsu-Shen CHU
  • Publication number: 20170148971
    Abstract: A thermoelectric conversion device includes at least one thermoelectric conversion unit. The thermoelectric conversion unit includes at least one first electrode, at least one second electrode, a P-type thermoelectric material, and an N-type thermoelectric material. The first electrode includes a first fluid channel, such that the first electrode has a first hollow structure. The second electrode includes a second fluid channel, such that the second electrode has a second hollow structure. The P-type thermoelectric material is located between the first electrode and the second electrode, and the second electrode is located between the P-type thermoelectric material and the N-type thermoelectric material.
    Type: Application
    Filed: December 30, 2015
    Publication date: May 25, 2017
    Inventors: Hsu-Shen Chu, Cheng-Cho Wong, Chih-Hao Chang
  • Patent number: 9123857
    Abstract: A thermoelectric material and a method for manufacturing the same are provided. The thermoelectric material includes a mixture of nano-thermoelectric crystal particles, micron-thermoelectric crystal particles and nano-metal particles.
    Type: Grant
    Filed: July 18, 2013
    Date of Patent: September 1, 2015
    Assignee: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsu-Shen Chu, Jenn-Dong Hwang, Chia-Chan Hsu, Tse-Hsiao Lee, Hong-Bin Wang
  • Publication number: 20150176904
    Abstract: A sample holder for annealing apparatus and electrically assisted annealing apparatus using the same are provided. The sample holder includes a heat conductive shell, high thermal conductive and electrical insulation blocks, first and second electrodes. The heat conductive shell includes a base frame and a top cover. The high thermal conductive and electrical insulation blocks are adjacent to the base frame and the top cover, respectively, and a sample pallet is sandwiched therebetween. Length and width of the sample pallet is smaller than that of the high thermal conductive and electrical insulation blocks. The first and the second electrodes are fixed to two sides of the sample pallet, and are connected to electrifying wire respectively. Thickness of the first and the second electrodes is smaller than that of the sample pallet, while the width of the first and the second electrodes is longer than that of the sample pallet.
    Type: Application
    Filed: November 19, 2014
    Publication date: June 25, 2015
    Inventors: Hsu-Shen Chu, Chien-Neng Liao, Yao-Hsiang Chen
  • Patent number: 8778215
    Abstract: An embodiment of the present disclosure provides a thermoelectric composite material including: a thermoelectric matrix including a thermoelectric material; and a plurality of nano-carbon material units located in the thermoelectric matrix and spaced apart from each other, wherein a spacing between two neighboring nano-carbon material unit is about 50 nm to 2 ?m.
    Type: Grant
    Filed: May 3, 2012
    Date of Patent: July 15, 2014
    Assignee: Industrial Technology Research Institute
    Inventors: Shih-Chun Tseng, Wen-Hsuan Chao, Hsu-Shen Chu
  • Publication number: 20140174492
    Abstract: A thermoelectric material and a method for manufacturing the same are provided. The thermoelectric material includes a mixture of nano-thermoelectric crystal particles, micron-thermoelectric crystal particles and nano-metal particles.
    Type: Application
    Filed: July 18, 2013
    Publication date: June 26, 2014
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Hsu-Shen Chu, Jenn-Dong Hwang, Chia-Chan Hsu, Tse-Hsiao Lee, Hong-Bin Wang
  • Publication number: 20130153819
    Abstract: An embodiment of the present disclosure provides a thermoelectric composite material including: a thermoelectric matrix including a thermoelectric material; and a plurality of nano-carbon material units located in the thermoelectric matrix and spaced apart from each other, wherein a spacing between two neighboring nano-carbon material unit is about 50 nm to 2 ?m.
    Type: Application
    Filed: May 3, 2012
    Publication date: June 20, 2013
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventors: Shih-Chun Tseng, Wen-Hsuan Chao, Hsu-Shen Chu
  • Publication number: 20130152990
    Abstract: A solid-liquid interdiffusion bonding structure of a thermoelectric module and a fabricating method thereof are provided. The method includes coating a silver, nickel, or copper layer on surfaces of a thermoelectric component and an electrode plate, and then coating a tin layer. A thermocompression treatment is performed on the thermoelectric component and the electrode plate, such that the melted tin layer reacts with the silver, nickel, or copper layer to form a silver-tin intermetallic compound, a nickel-tin intermetallic compound, or a copper-tin intermetallic compound. After cooling, the thermoelectric component and the electrode plate are bonded together.
    Type: Application
    Filed: November 4, 2012
    Publication date: June 20, 2013
    Inventors: Hong-Jen Lai, Jenn-Dong Hwang, Hsu-Shen Chu, Tung-Han Chuang, Chao-Chi Jain, Che-Wei Lin
  • Patent number: 8269098
    Abstract: A thermoelectric module device with thin film elements is disclosed. A pillar structure with a hollow region is formed by stacking a plurality of thin-film type thermoelectric module elements, each including a plurality thin-film thermoelectric pairs arranged in a ring. An insulating and thermal conducting layer covers the inner sidewalls of the hollow region of the pillar structure and the outer sidewalls of the pillar structure. A cool source and a heat source are disposed in the hollow region or outer side of the pillar structure, respectively.
    Type: Grant
    Filed: September 8, 2008
    Date of Patent: September 18, 2012
    Assignee: Industrial Technology Research Institute
    Inventor: Hsu-Shen Chu
  • Publication number: 20120167937
    Abstract: A thermoelectric module includes a first and a second substrates, plural thermoelectric elements, plural first and second metal electrodes, plural first and second solder layers, and spacers. The thermoelectric elements are disposed between the first and second substrates, and each pair includes a P-type and an N-type thermoelectric elements. An N-type thermoelectric element is electrically connected to the other P-type thermoelectric element of the adjacent pair of thermoelectric element by the second metal electrode. The first metal electrodes and the lower end surfaces of the P/N type thermoelectric elements are jointed by the first solder layers. The second metal electrodes and the upper end surfaces of the P/N type thermoelectric elements are jointed by the second solder layers. The spacers are positioned at one of the first and second solder layers. The melting point of the spacer is higher than the liquidus temperatures of the first and second solder layers.
    Type: Application
    Filed: August 1, 2011
    Publication date: July 5, 2012
    Inventors: Yuan-Chang Fann, Chun-Mu Chen, Hsu-Shen Chu, Cheng-Chuan Wang, Jenn-Dong Hwang
  • Publication number: 20120132242
    Abstract: A thermoelectric generator apparatus disposed on a high-temperature surface of an object (as a heat source), at least includes a heat concentrator, a thermoelectric module and a cold-side heat sink. The heat concentrator has a top surface and a bottom surface contacting a high-temperature surface of the object, and an area of the bottom surface is smaller than that of the high-temperature surface. The thermoelectric module is disposed on the top surface of the heat concentrator. The cold-side heat sink is disposed on the thermoelectric module. Heat generated by the heat source is concentrated on the heat concentrator and flows to the hot side of the thermoelectric module for increasing the heat flux (Q?) passing the thermoelectric module and the hot side temperature of the thermoelectric module. Consequently, the thermoelectric conversion efficiency (?) is improved, and the power generation of the thermoelectric module is increased.
    Type: Application
    Filed: December 29, 2010
    Publication date: May 31, 2012
    Inventors: Hsu-Shen Chu, Jenn-Dong Hwang
  • Patent number: 7777126
    Abstract: A thermoelectric device at least includes a ring-shaped insulated substrate and plural sets of thermoelectric thin film material pair (TEP) disposed thereon. The ring-shaped insulated substrate has an inner rim, an outer rim and a first surface. The sets of TEP electrically connected to each other are disposed on the first surface of the ring-shaped insulated substrate. Each set of TEP includes a P-type and an N-type thermoelectric thin film elements (TEE) electrically connected to each other. Also, the N-type TEE of each set is electrically connected to the P-type TEE of the adjacent set of TEP. When a current flows through the sets of TEP along a direction parallel to the surfaces of P-type and N-type thermoelectric thin film elements, a temperature difference is generated between the inner rim and the outer rim of the ring-shaped insulated substrate.
    Type: Grant
    Filed: August 4, 2008
    Date of Patent: August 17, 2010
    Assignee: Industrial Technology Research Institute
    Inventor: Hsu-Shen Chu
  • Publication number: 20090277490
    Abstract: A thermoelectric module device with thin film elements is disclosed. A pillar structure with a hollow region is formed by stacking a plurality of thin-film type thermoelectric module elements, each including a plurality thin-film thermoelectric pairs arranged in a ring. An insulating and thermal conducting layer covers the inner sidewalls of the hollow region of the pillar structure and the outer sidewalls of the pillar structure. A cool source and a heat source are disposed in the hollow region or outer side of the pillar structure, respectively.
    Type: Application
    Filed: September 8, 2008
    Publication date: November 12, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Hsu-Shen Chu
  • Publication number: 20090165835
    Abstract: A thermoelectric device at least includes a ring-shaped insulative substrate and plural sets of thermoelectric thin film material pair (TEP) disposed thereon. The ring-shaped insulative substrate has an inner rim, an outer rim and a first surface. The sets of TEP electrically connected to each other are disposed on the first surface of the ring-shaped insulative substrate. Each set of TEP includes a P-type and an N-type thermoelectric thin film elements (TEE) electrically connected to each other. Also, the N-type TEE of each set is electrically connected to the P-type TEE of the adjacent set of TER When a current flows through the sets of TEP along a direction parallel to the surfaces of P-type and N-type thermoelectric thin film elements, a temperature difference is generated between the inner rim and the outer rim of the ring-shaped insulative substrate.
    Type: Application
    Filed: August 4, 2008
    Publication date: July 2, 2009
    Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE
    Inventor: Hsu-Shen CHU