Patents by Inventor Hsu Shih-Ping

Hsu Shih-Ping has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Repaired structure of circuit board having pre-soldering bump and methods for repairing the same
    Publication number: 20070278673
    Abstract: A repaired structure of a circuit board having pre-soldering bumps and a method for repairing the same are proposed. Firstly, a circuit board having a plurality of pre-soldering bumps on a surface thereof is provided, wherein at least one of the pre-soldering bumps has a defect. Then, a micro-electroplating process or a micro-electrolyzing process is performed by a micro-electrode nearby the defective pre-soldering bump, so as to repair the defective pre-soldering bump. Therefore, the present invention is able to enhance the process yield and reduce the production cost.
    Type: Application
    Filed: November 21, 2006
    Publication date: December 6, 2007
    Applicant: PHEONIX PRECISION TECHNOLOGY CORPORATION
    Inventors: Hsu Shih-Ping, Shih Chao Wen