Patents by Inventor Hsu-Tan HUANG

Hsu-Tan HUANG has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • METHOD OF PREPARING HIGHLY THERMALLY CONDUCTIVE CIRCUIT SUBSTRATE
    Publication number: 20080251388
    Abstract: A method of preparing a highly thermally conductive circuit substrate includes the steps of preparing a metallic substrate, producing an insulated layer on a surface of the metallic substrate, producing an intermediate medium layer on a surface of the insulated layer, and producing an electrically conductive main layer on a surface of the intermediate medium layer.
    Type: Application
    Filed: July 10, 2007
    Publication date: October 16, 2008
    Applicant: Cosmos Vacuum Technology Corp.
    Inventors: Hsu-Tan HUANG, Chung-Lin Chou
  • HIGHLY THERMALLY CONDUCTIVE CIRCUIT SUBSTRATE
    Publication number: 20080251282
    Abstract: A highly thermally conductive circuit substrate includes a metallic substrate, an insulated layer, a first medium layer, and an electrically conductive layer. The insulated layer is formed on a surface of said metallic substrate. The first medium layer is formed on a surface of said insulated layer. The electrically conductive layer is formed on a surface of said first medium layer.
    Type: Application
    Filed: July 10, 2007
    Publication date: October 16, 2008
    Applicant: Cosmos Vacuum Technology Corporation
    Inventors: Hsu-Tan HUANG, Chung-Lin CHOU