Abstract: A heat sink using porous graphite having graphite particle-stacked porous graphite is provided. The heat sink may provide good heat conductivity and improve strength of carbon foam.

Abstract: A heat sink using porous graphite having graphite particle-stacked porous graphite is provided. The heat sink may provide good heat conductivity and improve strength of carbon foam. Also, a manufacturing method of porous graphite is provided.

Abstract: A manufacturing method of carbonaceous heat sink includes a mixing step and a molding step. In the mixing step, a graphite material is mixed with a thermosetting binder to obtain a mixture. In the molding step, the mixture is pressure formed with a mold into the carbonaceous heat sink, Preferably, the carbonaceous heat sink can increase its carbonaceous percentage by using a heat treating step. The manufacturing method can produce carbonaceous heat sinks with a high carbonaceous percentage with a low cost.

Abstract: A heat sink using porous graphite having graphite particle-stacked porous graphite is provided. The heat sink may provide good heat conductivity and improve strength of carbon foam. Also, a manufacturing method of porous graphite is provided.

Abstract: The present invention discloses a dual-photoresist method for forming fine-pitched solder bumps on flip chips by utilizing two separate layers of photoresist, i.e., a first thin photoresist layer for patterning the BLM layers on top of the aluminum bonding pads and a second thick photoresist layer for patterning the via openings on top of the BLM layers to supply the necessary thickness required for the solder bumps. The first, thin photoresist layer permits an accurate imaging process to be conducted without focusing problems which are normally associated with thick photoresist layers. As an optional step, the present invention may further utilize a thin layer of non-leachable metal such as Cu or Ni for coating on top of the BLM layer and thus further improving the electrical characteristics of the solder bumps subsequently formed thereon.

Abstract: A method for forming a wafer level package by incorporating an insulating pad of an elastic material under a dummy plug is described. In the method, a multiplicity of pads or islands formed of an elastic material is first formed on a pre-processed semiconductor substrate before a multiplicity of dummy via plugs are formed on top. The dummy via plugs are used as a support structure for building I/O redistribution lines (i.e. metal traces) thereon such that I/O bond pads may be built for supporting solder bumps or solder balls. The multiplicity of insulating pads is used for stress relief during a bonding process with the solder ball built on top without the conventional defect of cracking due to high elasticity of the material when a large area insulating layer is deposited on top.

Abstract: A method for forming solder balls that have improved height on an electronic substrate such as a silicon wafer and devices formed are disclosed. In the method, after solder bumps are deposited by a conventional method such as evaporation, electroplating, electroless plating or solder paste screen printing, the solder bumps are reflown on the substrate in an upside down position such that the gravity of the solder material pulls down the solder ball and thereby increasing its height after the reflow process is completed. It has been found that a minimum of 5%, and preferably about 10% height increase has been achieved. Another benefit achieved by the present invention novel method which is associated with the increase in the solder ball height is a corresponding increase in the pitch distance between the solder balls by at least 5%.