Patents by Inventor Hsu-Tung Chen

Hsu-Tung Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240107680
    Abstract: A subtractive method for manufacturing a circuit board with fine interconnect includes steps of disposing a resist film on a metal layer on a surface of a wiring substrate, and performing a dry etching process to etch and penetrate the resist film and form a wiring pattern groove in the metal layer, the depth of the wiring pattern groove is less than the thickness of the first metal layer; further wet etching process is performed, and the metal layer is etched again from the wiring pattern groove to penetrate the metal layer to form wires in the metal layer, and finally the resist film is removed. By first using dry etching to form wiring pattern grooves in the metal layer, the thickness of the metal layer to be removed by wet etching is reduced, thereby reducing side etching generated by the wet etching process and improving the wiring quality.
    Type: Application
    Filed: September 22, 2022
    Publication date: March 28, 2024
    Inventor: HSU-TUNG CHEN
  • Patent number: 9526179
    Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.
    Type: Grant
    Filed: March 2, 2015
    Date of Patent: December 20, 2016
    Assignee: MUTUAL-TEK INDUSTRIES CO., LTD.
    Inventors: Chiu Yu Chen, Wen-Chin Lai, Pui-Ren Jiang, Hsu-Tung Chen
  • Patent number: 9433098
    Abstract: A method of manufacturing a combined circuit board includes the following steps. First, through portions (TPs) arranged in a predetermined format are formed in a rigid substrate (RS) such that the RS is divided into a predetermined removed region (PRR1) and a predetermined reserved region (PRR2) according to the arrangement of the TPs. Next, a conductive bonding layer (CBL) and a flexible circuit board (FCB) are respectively laminated on two opposite sides of the RS and part of a dielectric bonding layer of the CBL fills the TPs. Next, the RS, the FCB and the CBL are bent according to the TPs such that the PRR2 is bent at the TPs relative to the PRR1. Finally, part of the RS located at the PRR1 and part of the CBL corresponding to the PRR1 are removed to form an indentation to expose part of the FCB.
    Type: Grant
    Filed: January 23, 2013
    Date of Patent: August 30, 2016
    Assignee: Mutual-Tek Industries Co., Ltd.
    Inventors: Shi Yu Chiou, Hsu-Tung Chen
  • Publication number: 20150257267
    Abstract: A printed circuit board and the method of manufacturing the same are provided. The printed circuit board comprises a supporting plate having a front side and a rear side; a first adhesive layer placed on the front side of the supporting plate; and a front wire layer embedded into the first adhesive layer. The front wire layer includes at least one external contact portion for connecting an electronic component, wherein the surface of the external contact portion is coplanar with the surface of the first adhesive layer surrounding the external contact portion.
    Type: Application
    Filed: March 2, 2015
    Publication date: September 10, 2015
    Inventors: Chiu Yu CHEN, Wen-Chin LAI, Pui-Ren JIANG, Hsu-Tung CHEN
  • Publication number: 20130292050
    Abstract: A method of manufacturing a combined circuit board includes the following steps. First, through portions (TPs) arranged in a predetermined format are formed in a rigid substrate (RS) such that the RS is divided into a predetermined removed region (PRR1) and a predetermined reserved region (PRR2) according to the arrangement of the TPs. Next, a conductive bonding layer (CRL) and a flexible circuit board (FCB) are respectively laminated on two opposite sides of the RS and part of a dielectric bonding layer of the CBL fills the TPs, Next, the RS, the FCB and the CBL are bent according to the TPs such that the PRR2 is bent at the TPs relative to the PRR1, Finally, part of the RS located at the PRR1 and part of the CBL corresponding to the PRR1 are removed to form an indentation to expose part of the FCB.
    Type: Application
    Filed: January 23, 2013
    Publication date: November 7, 2013
    Applicant: MUTUAL-TEK INDUSTRIES CO., LTD.
    Inventors: Shi Yu Chiou, Hsu-Tung Chen
  • Patent number: 7821676
    Abstract: A method to calculate a transform coordinate on a second video of an object having an target coordinate on a first video and related operation process and video surveillance system are disclosed. The method includes the steps of generating the first video with a first video surveillance device, generating the second video with a second video surveillance device, selecting a first predetermined number of first reference objects also existing on the second video from the first video, calculating a plurality of coordinate transform coefficients of a first coordinate transform function according to the first predetermined number of first coordinates where the first reference objects are on the first video and the first predetermined number of second coordinates where the first reference objects are on the second video, and substituting the target coordinate into the first coordinate transform function, which had the first coordinate transform coefficients, and calculating the transform coordinate.
    Type: Grant
    Filed: October 4, 2005
    Date of Patent: October 26, 2010
    Assignee: Huper Laboratories Co., Ltd.
    Inventors: Chao-Ming Wang, Hsu-Tung Chen
  • Publication number: 20060152584
    Abstract: A method to calculate a transform coordinate on a second video of an object having an target coordinate on a first video and related operation process and video surveillance system are disclosed. The method includes the steps of generating the first video with a first video surveillance device, generating the second video with a second video surveillance device, selecting a first predetermined number of first reference objects also existing on the second video from the first video, calculating a plurality of coordinate transform coefficients of a first coordinate transform function according to the first predetermined number of first coordinates where the first reference objects are on the first video and the first predetermined number of second coordinates where the first reference objects are on the second video, and substituting the target coordinate into the first coordinate transform function, which had the first coordinate transform coefficients, and calculating the transform coordinate.
    Type: Application
    Filed: October 4, 2005
    Publication date: July 13, 2006
    Inventors: Chao-Ming Wang, Hsu-Tung Chen
  • Patent number: 6151409
    Abstract: We discloses an efficient method for compressing a color image, visual block pattern truncation coding (VBPTC), in which the conventional block truncation coding (BTC) serves to encode an original image. This method defines the edge block according to human visual perception. If the difference between the two quantized values of BTC in a block is larger than a threshold which is defined by visual characteristics, the block will be identified as an edge block. In an edge block, the bitmap is adapted to compute block gradient orientation and to match the block pattern.
    Type: Grant
    Filed: March 13, 1998
    Date of Patent: November 21, 2000
    Assignee: National Science Council
    Inventors: Liang-Gee Chen, Yuan-Chen Liu, Yung-Pin Lee, Po-Cheng Wu, Hsu-Tung Chen