Patents by Inventor Hsu Yu-Nu

Hsu Yu-Nu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Encapsulation of MEMS devices using pillar-supported caps
    Patent number: 7153717
    Abstract: This invention comprises a process for fabricating a MEMS microstructure in a sealed cavity wherein the etchant entry holes are created as a by-product of the fabrication process without an additional step to etch holes in the cap layer. The process involves extending the layers of sacrificial material past the horizontal boundaries of the cap layer. The cap layer is supported by pillars formed by a deposition in holes etched through the sacrificial layers, and the etchant entry holes are formed when the excess sacrificial material is etched away, leaving voids between the pillars supporting the cap.
    Type: Grant
    Filed: December 13, 2002
    Date of Patent: December 26, 2006
    Assignee: IC Mechanics Inc.
    Inventors: L. Richard Carley, Suresh Santhanam, Hsu Yu-Nu
  • Encapsulation of MEMS devices using pillar-supported caps
    Publication number: 20030153116
    Abstract: This invention comprises a process for fabricating a MEMS microstructure in a sealed cavity wherein the etchant entry holes are created as a by-product of the fabrication process without an additional step to etch holes in the cap layer. The process involves extending the layers of sacrificial material past the horizontal boundaries of the cap layer. The cap layer is supported by pillars formed by a deposition in holes etched through the sacrificial layers, and the etchant entry holes are formed when the excess sacrificial material is etched away, leaving voids between the pillars supporting the cap.
    Type: Application
    Filed: December 13, 2002
    Publication date: August 14, 2003
    Inventors: L. Richard Carley, Suresh Santhanam, Hsu Yu-Nu