Abstract: An elastic heat conduction mechanism for electronic devices includes a heat-conducting unit and a heat-exchanging member that are tightly assembled in an elastic and floating docking adjustment to achieve the effect of preset heating element cooling. The base and heat-conducting assembly of the heat-conducting unit are floatingly assembled in the storage space of the heat-exchanging member to form a floating adjustment and a stable fit to assist the preset heating element to quickly dissipate heat.

Abstract: A 3D extended cooling mechanism includes cabinet, air intake module, heat exchange module including heat exchanger, air baffle and bottom plate, first wind tunnel defined above the air baffle, second wind tunnel defined between air baffle and bottom plate and third wind tunnel defined between bottom plate and bottom of cabinet. First, second and third wind tunnels accept the air drawn by air intake module to form a respective cold air stream. Heat exchanger accepts cold air stream of first wind tunnel for heat exchange, enabling hot air produced in heat exchange to be delivered to air outlet of cabinet for discharge. First, second, and third wind tunnels are designed to dissipate the relatively low temperature airflow into high temperature sensitive heat source components in the longitudinal direction and the lateral direction so that heat source elements can be efficiently dissipated at the same time to achieve three-dimensional expansion cooling.

Abstract: A 3D extended cooling mechanism includes cabinet, air intake module, heat exchange module including heat exchanger, air baffle and bottom plate, first wind tunnel defined above the air baffle, second wind tunnel defined between air baffle and bottom plate and third wind tunnel defined between bottom plate and bottom of cabinet. First, second and third wind tunnels accept the air drawn by air intake module to form a respective cold air stream. Heat exchanger accepts cold air stream of first wind tunnel for heat exchange, enabling hot air produced in heat exchange to be delivered to air outlet of cabinet for discharge. First, second, and third wind tunnels are designed to dissipate the relatively low temperature airflow into high temperature sensitive heat source components in the longitudinal direction and the lateral direction so that heat source elements can be efficiently dissipated at the same time to achieve three-dimensional expansion cooling.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: A data storage device mounting structure includes a data storage device insertable through an insertion slot into an accommodation chamber in an electronic device, a mounting assembly including a mounting plate affixed to one corner of the data storage device and a metal wire rod having a middle part thereof bent backwards to provide a curved arch portion and two opposite ends thereof connected to one end of the mounting plate, and an operating handle fixedly fastened to the curved arch portion of the metal wire rod and operable by the user to drag the metal wire rod in pulling the data storage device out of the accommodation chamber of the electronic apparatus conveniently with less effort. The mounting assembly and the operating handle have a small size, and are easy and inexpensive to manufacture.

Abstract: A data storage device mounting structure includes a data storage device insertable through an insertion slot into an accommodation chamber in an electronic device, a mounting assembly including a mounting plate affixed to one corner of the data storage device and a metal wire rod having a middle part thereof bent backwards to provide a curved arch portion and two opposite ends thereof connected to one end of the mounting plate, and an operating handle fixedly fastened to the curved arch portion of the metal wire rod and operable by the user to drag the metal wire rod in pulling the data storage device out of the accommodation chamber of the electronic apparatus conveniently with less effort. The mounting assembly and the operating handle have a small size, and are easy and inexpensive to manufacture.

Abstract: A cooling mechanism of high mounting flexibility includes a heat sink including a heat sink body defining an accommodation portion and position-limit sliding grooves and stop blocks fastened to the heat sink body, heat pipes positioned in the position-limit sliding grooves and stopped against the stop blocks, each heat pipe having a hot interface accommodated in the accommodation portion and an opposing cold interface positioned in one position-limit sliding groove, heat transfer blocks each defining a recessed insertion passage for accommodating the hot interfaces of the heat pipes and an opposing planar contact surface for the contact of a heat source of an external circuit board, and an elastic member elastically positioned between the heat sink and the heat transfer blocks.

Abstract: A multi-stack storage module board assembly includes a host board having an electric connector, multiple brackets mounted on the host board and fastened to one another in a stack, multiple multimedia storage devices respectively mounted in the brackets, and adapter modules mounted on support arms in the brackets to electrically connect the multimedia storage devices to the connector of the host board. Each adapter module has a first connector, which receives one multimedia storage device, a second connector connectable to the connector of the host board, and a third connector for receiving the second connector of another adapter module.