Patents by Inventor Hsuan-Cheng Fan

Hsuan-Cheng Fan has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Light emitting device and the manufacture method thereof
    Patent number: 8664686
    Abstract: This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.
    Type: Grant
    Filed: October 25, 2011
    Date of Patent: March 4, 2014
    Assignee: Epistar Corporation
    Inventors: Yuh-Ren Shieh, Hsuan-Cheng Fan, Jin-Ywan Lin, Cheng-Yi Hsu, Chung-Kuei Huang
  • LIGHT EMITTING DEVICE AND THE MANUFACTURE METHOD THEREOF
    Publication number: 20120040480
    Abstract: This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.
    Type: Application
    Filed: October 25, 2011
    Publication date: February 16, 2012
    Inventors: Yuh-Ren Shieh, Hsuan-Cheng Fan, Jin-Ywan Lin, Cheng-Yi Hsu, Chung-Kuei Huang
  • Light emitting device and the manufacture method thereof
    Patent number: 8067780
    Abstract: This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.
    Type: Grant
    Filed: September 5, 2007
    Date of Patent: November 29, 2011
    Assignee: Epistar Corporation
    Inventors: Yuh-Ren Shieh, Hsuan-Cheng Fan, Jin-Ywan Lin, Cheng-Yi Hsu, Chung-Kuei Huang
  • Light emitting device and the manufacture method thereof
    Publication number: 20080054290
    Abstract: This invention provides a light-emitting element and the manufacture method thereof. The light-emitting element is suitable for flip-chip bonding and comprises an electrode having a plurality of micro-bumps for direct bonding to a submount. Bonding within a relatively short distance between the light-emitting device and the submount can be formed so as to improve the heat dissipation efficiency of the light-emitting device.
    Type: Application
    Filed: September 5, 2007
    Publication date: March 6, 2008
    Applicant: EPISTAR CORPORATION
    Inventors: Yuh-Ren Shieh, Hsuan-Cheng Fan, Jin-Ywan Lin, Chung-Yi Hsu, Chung-Kuei Huang