Patents by Inventor Hsuan-Chia KAO

Hsuan-Chia KAO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • SYSTEM AND METHOD FOR HIGH SPEED INSPECTION OF SEMICONDUCTOR SUBSTRATES
    Publication number: 20230360975
    Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.
    Type: Application
    Filed: July 18, 2023
    Publication date: November 9, 2023
    Inventors: Sheng He HUANG, Chung-Pin CHOU, Shiue-Ming GUO, Hsuan-Chia KAO, Yan-Cheng CHEN, Sheng-Ching KAO, Jun Xiu LIU
  • System and method for high speed inspection of semiconductor substrates
    Patent number: 11749571
    Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.
    Type: Grant
    Filed: August 31, 2021
    Date of Patent: September 5, 2023
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
    Inventors: Sheng He Huang, Chung-Pin Chou, Shiue-Ming Guo, Hsuan-Chia Kao, Yan-Cheng Chen, Sheng-Ching Kao, Jun Xiu Liu
  • SYSTEM AND METHOD FOR HIGH SPEED INSPECTION OF SEMICONDUCTOR SUBSTRATES
    Publication number: 20230068133
    Abstract: In a method of inspection of a semiconductor substrate a first beam of light is split into two or more second beams of light. The two or more second beams of light are respectively transmitted onto a first set of two or more first locations on top of the semiconductor substrate. In response to the transmitted two or more second beams of light, two or more reflected beams of light from the first set of two or more first locations are received. The received two or more reflected beams of light are detected to generate two or more detected signals. The two or more detected signals are analyzed to determine whether a defect exists at the set of the two or more first locations.
    Type: Application
    Filed: August 31, 2021
    Publication date: March 2, 2023
    Inventors: Sheng He HUANG, Chung-Pin CHOU, Shiue-Ming GUO, Hsuan-Chia KAO, Yan-Cheng CHEN, Sheng-Ching KAO, Jun Xiu LIU