Patents by Inventor Hsuan-Chih Chu

Hsuan-Chih Chu has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20210071295
    Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.
    Type: Application
    Filed: November 23, 2020
    Publication date: March 11, 2021
    Inventors: Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Chun-Chih Lin
  • Patent number: 10844477
    Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.
    Type: Grant
    Filed: November 8, 2017
    Date of Patent: November 24, 2020
    Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
    Inventors: Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Chun-Chih Lin
  • Publication number: 20190136369
    Abstract: Sputtering systems and methods are provided. In an embodiment, a sputtering system includes a chamber configured to receive a substrate, a sputtering target positioned within the chamber, and an electromagnet array over the sputtering target. The electromagnet array includes a plurality of electromagnets.
    Type: Application
    Filed: November 8, 2017
    Publication date: May 9, 2019
    Inventors: Hsuan-Chih Chu, Chien-Hsun Pan, Yen-Yu Chen, Chun-Chih Lin