Abstract: A photo-detecting device includes a first semiconductor layer with a first dopant, a light-absorbing layer, a second semiconductor layer, and a semiconductor contact layer. The second semiconductor layer is located on the first semiconductor layer and has a first region and a second region, the light absorbing layer is located between the first semiconductor layer and the second semiconductor layer and has a third region and a fourth region, the semiconductor contact layer contacts the first region. The first region includes a second dopant and a third dopant, the second region includes second dopant, and the third region includes third dopant. The semiconductor contact layer has a first thickness greater than 50 ? and smaller than 1000 ?.

Abstract: The present disclosure related to an effort-saving crank structure (1) of a bicycle (8), which includes: a crank mechanism (10) having a crank (11), a shaft end gear (12) and a treadle end gear (13) disposed on the crank (11); a transmission mechanism (20) disposed in the crank (11) and having a rotation shaft (21) and a first gear (22) and a second gear (23) connected to the rotation shaft (21), the first gear (22) and the shaft end gear (12) are engaged for transmission, and the second gear (23) and the treadle end gear (13) are engaged for transmission; a rotation arm unit (30) having a first rotation arm (31) and a second rotation arm (32), two ends of the second rotation arm (32) are respectively connected to the first rotation arm (31) and the treadle end gear (13).

Abstract: The present disclosure related to an effort-saving crank structure (1) of a bicycle (8), which includes: a crank mechanism (10) having a crank (11), a shaft end gear (12) and a treadle end gear (13) disposed on the crank (11); a transmission mechanism (20) disposed in the crank (11) and having a rotation shaft (21) and a first gear (22) and a second gear (23) connected to the rotation shaft (21), the first gear (22) and the shaft end gear (12) are engaged for transmission, and the second gear (23) and the treadle end gear (13) are engaged for transmission; a rotation arm unit (30) having a first rotation arm (31) and a second rotation arm (32), two ends of the second rotation arm (32) are respectively connected to the first rotation arm (31) and the treadle end gear (13).

Abstract: A muscle power detection device and a muscle power detection method for detecting and classifying a muscle power status of a subject are provided. The muscle power detection device includes an inertia measurement unit, a pressure detection unit and a processing unit. The inertia measurement unit is configured to be arranged at a part of the subject and to obtain inertial data corresponding to the part of the subject according to movement status of the part of the subject. The pressure detection unit is configured to detection external force applied on the part of the subject to obtain pressure data. The processing unit is configured to perform an operation on the inertial data and the pressure data for obtaining evaluation values, and to obtain muscle power information corresponding to the part of the subject according to the evaluation values.

Abstract: A muscle power detection device and a muscle power detection method for detecting and classifying a muscle power status of a subject are provided. The muscle power detection device includes an inertia measurement unit, a pressure detection unit and a processing unit. The inertia measurement unit is configured to be arranged at a part of the subject and to obtain inertial data corresponding to the part of the subject according to movement status of the part of the subject. The pressure detection unit is configured to detection external force applied on the part of the subject to obtain pressure data. The processing unit is configured to perform an operation on the inertial data and the pressure data for obtaining evaluation values, and to obtain muscle power information corresponding to the part of the subject according to the evaluation values.

Abstract: A composite hollow board structure and a manufacturing method thereof are provided. The composite hollow board structure includes a first plate having a surface formed of a plurality of first conical rings and a plurality of first attachment rings thereon; and a second plate pressed onto the first plate and having a surface formed a plurality of second conical rings and a plurality of second attachment rings thereon; wherein each first conical ring and each second attachment ring are inserted onto each other, each second conical ring and each first attachment ring are inserted onto each other; a hollow cavity is respectively formed between each first conical ring and each second attachment ring as well as between each second conical ring and each first attachment ring. Accordingly, the known bonding or welding step can be omitted to increase deformation capacity with simplified process and reduced manufacturing time.

Abstract: An electronic implement replacement structure includes a housing body (102) and an electronic module (300). The housing body (102) has a base (110) and a connecting ring (120) connected to the base (110). The connecting ring (120) includes press portions (124) and notches (122) spaced apart from one another and respectively disposed between each two adjacent press portion (124). A guiding groove (126) is formed on an outer surface of each of the press portions (124). The electronic module (300) is disposed on the base (110) and corresponding to the connecting ring (120). The electronic module (300) includes an electronic unit (310) and a rotatable ring (330) enclosing the electronic unit (310). An inner wall of the rotatable ring (330) has a sliding block (332) correspondingly and rotatably engaged with the guiding groove (126). Therefore, assembling and disassembling can be achieved without any tools.

Abstract: A light emitting diode (LED) lamp structure (100) of the present invention includes a housing body (102), a LED lamp module (500), and an electronic module (700, 700?). The housing body (102) includes a lamp base (200), a module base (400), a connecting ring (300) connecting the lamp base (200), and at least one clasping member (104) connecting the module base (400). The LED lamp module (500) connects the connecting ring (300) and is disposed on the lamp base (200). The electronic module (700, 700?) connects the clasping member (104) and is disposed on the module base (400). Thereby, assembling, disassembling and replacing can be achieved without any tools. Meanwhile, the entrance of moisture is also prevented, so that a life span of an electronic device is prolonged.

Abstract: A light emitting diode (LED) lamp structure (100) of the present invention includes a housing body (102), a LED lamp module (500), and an electronic module (700, 700?). The housing body (102) includes a lamp base (200), a module base (400), a connecting ring (300) connecting the lamp base (200), and at least one clasping member (104) connecting the module base (400). The LED lamp module (500) connects the connecting ring (300) and is disposed on the lamp base (200). The electronic module (700, 700?) connects the clasping member (104) and is disposed on the module base (400). Thereby, assembling, disassembling and replacing can be achieved without any tools. Meanwhile, the entrance of moisture is also prevented, so that a life span of an electronic device is prolonged.

Abstract: An electronic device replacement structure (100) includes a housing body (102) and an electronic module (200, 200?). The housing body (102) includes a base (110) and at least one clasping member (120) connected with one side of the base (110). The base (110) is disposed inside the housing body (102), and a first plate (130) is protrudingly disposed on the base (110). The electronic module (200, 200?) is disposed on the base (110) and corresponding to the clasping member (120). The electronic module (200, 200?) includes a casing (210) and a fastening implement (300) connected to the casing (210). The fastening implement (300) has at least one elastic locking element (310) and a second plate (320). The elastic locking element (310) is engaged with the clasping member (120). The second plate (320) protrudes toward the first plate (130) and contacts against the first plate (130).

Abstract: An electronic implement replacement structure includes a housing body (102) and an electronic module (300). The housing body (102) has a base (110) and a connecting ring (120) connected to the base (110). The connecting ring (120) includes press portions (124) and notches (122) spaced apart from one another and respectively disposed between each two adjacent press portion (124). A guiding groove (126) is formed on an outer surface of each of the press portions (124). The electronic module (300) is disposed on the base (110) and corresponding to the connecting ring (120). The electronic module (300) includes an electronic unit (310) and a rotatable ring (330) enclosing the electronic unit (310). An inner wall of the rotatable ring (330) has a sliding block (332) correspondingly and rotatably engaged with the guiding groove (126). Therefore, assembling and disassembling can be achieved without any tools.

Abstract: An electronic device replacement structure (100) includes a housing body (102) and an electronic module (200, 200?). The housing body (102) includes a base (110) and at least one clasping member (120) connected with one side of the base (110). The base (110) is disposed inside the housing body (102), and a first plate (130) is protrudingly disposed on the base (110). The electronic module (200, 200?) is disposed on the base (110) and corresponding to the clasping member (120). The electronic module (200, 200?) includes a casing (210) and a fastening implement (300) connected to the casing (210). The fastening implement (300) has at least one elastic locking element (310) and a second plate (320). The elastic locking element (310) is engaged with the clasping member (120). The second plate (320) protrudes toward the first plate (130) and contacts against the first plate (130).

Abstract: A LED head sink module includes a LED module, which comprises a circuit substrate, a LED chip installed in the circuit substrate, a packing cup molded on the circuit substrate around the LED chip and a lens molded on the packing cup over the LED chip, a heat sink, which has a base and a flat mounting block located on the bottom side of the base for stopping against the circuit substrate of the LED module for absorbing waste heat, a bracket, which has a center opening that receives the circuit substrate of the LED module, first retaining members for fastening to a retaining portion at the periphery of the packing cup and second retaining members for fastening to the flat mounting block of the heat sink, and a water seal sandwiched between the LED module and the bracket to seal off outside moisture and dust.

Abstract: A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit.

Abstract: A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light.

Abstract: A light-emitting device pressure ring structure includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a holder member insertable in the mounting base, a light-emitting unit fixedly mounted in the holder member with a bottom heat sink thereof suspending outside the holder member and tubular electrodes thereof connectable to the electrode pins of the circuit board for power input, and a pressure ring cap detachably threaded onto the mounting base to hold down the holder member and to keep the heat sink of the light-emitting unit outside the mounting base for quick dissipation of waste heat from the light-emitting devices of the light-emitting unit.

Abstract: A light-emitting unit adapter module includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a light-emitting unit mountable in the mounting base, and a holding-down device fastenable to the mounting base to hold down the light-emitting unit, keeping the tubular electrodes of the light-emitting unit in positive contact with the electrode pins of the circuit board for power input and the heat sink of the light-emitting unit suspending outside the mounting base for quick dissipation of waste heat during operation of the light-emitting devices of the light-emitting unit.

Abstract: A light-emitting device pressure ring structure includes a mounting base for mounting, a circuit board accommodated in the mounting base and having electrode pins connectable to an external power source, a holder member insertable in the mounting base, a light-emitting unit fixedly mounted in the holder member with a bottom heat sink thereof suspending outside the holder member and tubular electrodes thereof connectable to the electrode pins of the circuit board for power input, and a pressure ring cap detachably threaded onto the mounting base to hold down the holder member and to keep the heat sink of the light-emitting unit outside the mounting base for quick dissipation of waste heat from the light-emitting devices of the light-emitting unit.

Abstract: A method of fabricating a LED module by: bonding one or multiple LED chips and multiple conducting terminals to a circuit substrate, and then molding a packing cup on the circuit substrate over by over molding for enabling the LED chip(s) and the conducting terminals to be exposed to the outside of the packing cup, and then molding a lens on the packing cup and the LED chip(s) by over-molding. By means of directly molding the lens on the packing cup and the LED chip(s), no any gap is left in the lens, avoiding deflection, total reflection or light attenuation and enhancing luminous brightness and assuring uniform distribution of output light.

Abstract: A LED head sink module includes a LED module, which comprises a circuit substrate, a LED chip installed in the circuit substrate, a packing cup molded on the circuit substrate around the LED chip and a lens molded on the packing cup over the LED chip, a heat sink, which has a base and a flat mounting block located on the bottom side of the base for stopping against the circuit substrate of the LED module for absorbing waste heat, a bracket, which has a center opening that receives the circuit substrate of the LED module, first retaining members for fastening to a retaining portion at the periphery of the packing cup and second retaining members for fastening to the flat mounting block of the heat sink, and a water seal sandwiched between the LED module and the bracket to seal off outside moisture and dust.