Abstract: A server device is provided. The server device includes a chassis with a containing space, first and second openings. The first and second openings are located at two opposite ends of the containing space. The chassis includes a motherboard module in the containing space; a power-supply module disposed in the containing space, electrically connected to the motherboard module, and capable of plugging in and out from the chassis via the first opening, wherein the power-supply module comprises a first power port located in the first opening; a power port connector comprising a second power port located in the second opening, and configured to selectively connect to the first power port located in the first opening; and a storage array module, electrically connected to the motherboard module and the power-supply module.

Abstract: A server device is provided. The server device includes a chassis with a containing space, first and second openings. The first and second openings are located at two opposite ends of the containing space. The chassis includes a motherboard module in the containing space; a power-supply module disposed in the containing space, electrically connected to the motherboard module, and capable of plugging in and out from the chassis via the first opening, wherein the power-supply module comprises a first power port located in the first opening; a power port connector comprising a second power port located in the second opening, and configured to selectively connect to the first power port located in the first opening; and a storage array module, electrically connected to the motherboard module and the power-supply module.

Abstract: A heat-dissipating structure having an external fan includes a casing, a connecting piece and a heat-dissipating fan. The casing is provided with a plurality of heat-dissipating holes. The connecting piece is provided outside the casing. The heat-dissipating fan is assembled on the connecting piece to correspond to the positions of the heat-dissipating holes. An accommodating space is formed between the heat-dissipating fan and the casing. Via this arrangement, the heat-dissipating fan can be provided outside the casing to cooperate with the heat-dissipating holes, thereby dissipating the heat within the casing quickly.

Abstract: A fungal glucoamylase including a mutation pair Asn20Cys coupled with Ala27Cys forming a disulfide bond between the two members of the pair. The mutation provides increased thermal stability and reduced isomaltose formation to the enzyme. A fungal glucoamylase including a 311-314Loop mutation wherein reduced isomaltose formation is provided by the mutation is also provided. A fungal glucoamylase including a mutation Ser411Ala wherein increased pH optimum and reduced isomaltose formation is provided by the mutation is also provided. Combinations of the mutations in engineered glucoamylases are also provided as are combinations with other glucoamylase mutations that provide increased thermal stability, increased pH optimum and reduced isomaltose froamtion for cumulative improvements in the engineered glucoamylases. Also provided is a fungal glucoamylase including a mutation of Ser30Pro coupled with at least two stabilizing mutations forming a disulfide bond between the two stabilizing members.