Patents by Inventor Hsuan-Lun Kuo

Hsuan-Lun Kuo has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of package on package structure
    Patent number: 11996400
    Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai, Chia-Lun Chang, Chih-Chiang Tsao, Philip Yu-Shuan Chung
  • CAPACITIVE TOUCH APPARATUS AND SENSING METHOD THEREOF
    Publication number: 20140043282
    Abstract: A capacitive touch apparatus and a sensing method thereof are provided. The capacitive touch apparatus includes an electrostatic detection panel, and a sensing device. The sensing device is coupled to the electrostatic detection panel, and configured to sense a variation of electrostatic field on the electrostatic detection panel, and generate at least one touch sensing signal accordingly.
    Type: Application
    Filed: December 10, 2012
    Publication date: February 13, 2014
    Applicant: WinPower Optronics Corporation
    Inventors: Yao-Hung Lai, Chih-Hsiung Chen, Chih-Wen Lu, Hsuan-Lun Kuo