Patents by Inventor Hsuan-Min HO

Hsuan-Min HO has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Short-circuit probe card, wafer test system, and fault detection method for the wafer test system
    Patent number: 11821919
    Abstract: The present invention provides a short-circuit probe card, including: a substrate having an upper surface and a lower surface; a plurality of first contacts formed on the upper surface; and a plurality of second contacts formed on the lower surface and connected to the plurality of first contacts. The first contacts and second contacts are all grounded.
    Type: Grant
    Filed: June 25, 2020
    Date of Patent: November 21, 2023
    Assignee: WINDBOND ELECTRONICS CORP.
    Inventors: Chung-Hsuan Kan, Shu-Chi Lin, Yih-Chau Chen, Yuan-Long Tsai, Hsuan-Min Ho
  • SHORT-CIRCUIT PROBE CARD, WAFER TEST SYSTEM, AND FAULT DETECTION METHOD FOR THE WAFER TEST SYSTEM
    Publication number: 20210123951
    Abstract: The present invention provides a short-circuit probe card, including: a substrate having an upper surface and a lower surface; a plurality of first contacts formed on the upper surface; and a plurality of second contacts formed on the lower surface and connected to the plurality of first contacts. The first contacts and second contacts are all grounded.
    Type: Application
    Filed: June 25, 2020
    Publication date: April 29, 2021
    Applicant: Winbond Electronics Corp.
    Inventors: Chung-Hsuan KAN, Shu-Chi LIN, Yih-Chau CHEN, Yuan-Long TSAI, Hsuan-Min HO