Patents by Inventor Hsuan-Peng Lin

Hsuan-Peng Lin has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Manufacturing method of package on package structure
    Patent number: 11996400
    Abstract: A manufacturing method of a package-on-package structure includes at least the following steps. Top packages are mounted on a top side of a reconstructed wafer over a flexible tape, where conductive bumps at a bottom side of the reconstructed wafer is attached to the flexible tape, and during the mounting, a shape geometry of the respective conductive bump changes and at least a lower portion of the respective conductive bump is embraced by the flexible tape. The flexible tape is released from the conductive bumps after the mounting.
    Type: Grant
    Filed: April 27, 2022
    Date of Patent: May 28, 2024
    Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.
    Inventors: Hsuan-Ting Kuo, Ching-Hua Hsieh, Cheng-Ting Chen, Hsiu-Jen Lin, Hao-Jan Pei, Yu-Peng Tsai, Chia-Lun Chang, Chih-Chiang Tsao, Philip Yu-Shuan Chung
  • Transparent ceramic structure and surface treatment method of the same
    Publication number: 20060093834
    Abstract: A transparent ceramic structure and a method of surface treatment thereof are disclosed. A glass powder is applied over an unpolished surface of an intrinsically transparent ceramic structure. The ceramic structure is then placed in high temperature which is higher than the melting temperature of the glass powder and lower than 1,700 ° C. for about 1 minute to about 5 minutes. The transparent ceramic structure is removed from the environment and cooled down so as to obtain the desired transparency and strength of the ceramic structure.
    Type: Application
    Filed: November 21, 2005
    Publication date: May 4, 2006
    Inventors: Yung-Jen Lin, Jung-Chang Hu, Chien-Ming Tseng, Hsuan-Peng Lin, Chih-Chao Hsu
  • Transparent ceramic structure and surface treatment method of the same
    Publication number: 20060093738
    Abstract: A transparent ceramic structure and a method of surface treatment thereof are disclosed. A glass powder is applied over an unpolished surface of an intrinsically transparent ceramic structure. The ceramic structure is then placed in high temperature which is higher than the melting temperature of the glass powder and lower than 1,700° C. for about 1 minute to about 5 minutes. The transparent ceramic structure is removed from the environment and cooled down so as to obtain the desired transparency and strength of the ceramic structure.
    Type: Application
    Filed: November 1, 2004
    Publication date: May 4, 2006
    Inventors: Yung-Jen Lin, Jung-Chang Hu, Chien-Ming Tseng, Hsuan-Peng Lin, Chih-Chao Hsu