Abstract: A manufacturing method of the package carrier includes the following steps. A circuit substrate having a through via is provided. A heat-conducting material layer coving the inner wall of the through via is electroplated on the circuit substrate. A first build-up structure and a second build-up structure are respectively formed on two opposite sides of the circuit substrate. Parts of the first build-up structure, the circuit substrate, the heat-conducting material layer and the second build-up structure are removed to expose the remaining heat-conducting material layer, so as to define a heat-conducting element and form a circuit structure layer including a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion.

Abstract: A hotel demand evaluation method includes setting a plurality of keywords, collecting a plurality of texts according to the plurality of keywords, selecting a plurality of valid texts from the plurality of texts, performing a semantic analysis operation to identify at least one time keyword and at least one location keyword in the plurality of valid texts, generating a classification result according to at least the at least one time keyword and the at least one location keyword, classifying each valid text of the plurality of valid texts into a positive impact group, a no impact group or a negative impact group according to the classification result, and generating a hotel demand score of a specific region according to at least one valid text of the positive impact group and/or at least one valid text of the negative impact group.

Abstract: A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.

Abstract: A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.

Abstract: A method for predicting operational indicators includes performing a training operation according to first data to train a demand model, inputting second data into the demand model to generate predicted demand data, collecting actual demand data, and performing an adjustment operation according to the predicted demand data and the actual demand data to update the demand model.

Abstract: A method for feature extraction and data prediction based on pre-training, includes building a first neural network, inputting first processed data to the first neural network to perform a first training operation to generate a first trained neural network, inputting second processed data to the first trained neural network and fixing a first portion of neurons of the first trained neural network to perform a second training operation to generate a second trained neural network, and inputting third processed data to the second trained neural network to generate a predicted result. A first portion of neurons of the second trained neural network is the same as the first portion of neurons of the first trained neural network.

Abstract: A method for allocating perishable products based on machine learning, includes using a sales estimation model to evaluate estimated sales of a plurality of perishable products in a predetermined period, using a rating model to calculate a predetermined rate of the plurality of perishable products in the predetermined period according to the estimated sales, using an allocation model to adjust an allocation ratio of the plurality of perishable products in a plurality of marketing channels according to the estimated sales and the predetermined rate if a current rate is lower than the predetermined rate, and determining the numbers of perishable products allocated to the plurality of marketing channels according to the allocation ratio.

Abstract: A rate adjustment method includes a rate estimation model generating a plurality of estimated rates according to a plurality of training data, a revenue estimation model generating an estimated revenue according to the plurality of estimated rates, updating the rate estimation model according to the estimated revenue to generate an updated rate estimation model, and inputting a plurality of current data into the updated rate estimation model to update the plurality of estimated rates.

Abstract: A method for retrieving data on a web page includes performing a simulated user operation on a target web page to generate a result web page, retrieving a source code of the result web page, creating a data table according to the source code, and performing a data cleaning operation with the data table to generate cleaned data and store the cleaned data in a database. Each temporary row of the data table is corresponding to a quotation plan.

Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

Abstract: A package carrier includes a circuit structure layer and a heat-conducting element. The circuit structure layer includes a notch portion. The heat-conducting element includes a first heat-conducting portion and a second heat-conducting portion vertically connected to the first heat-conducting portion. The notch portion exposes the first heat-conducting portion, and an outer surface of the second heat-conduction portion is aligned with a side surface of the circuit structure layer.

Abstract: A circuit board and a method of manufacturing the same are provided. The method includes the following steps of providing a first conductive layer; providing an adhesive material and at least one conductive bump, in which the adhesive material is electrically conductive; adhering at least one conductive bump to a surface of the first conductive layer using the adhesive material; providing an insulation layer; disposing the insulation layer on the surface of the first conductive layer and at least one conductive bump; and disposing a second conductive layer on the insulation layer.

Abstract: A package structure including a circuit board and a heat generating element is provided. The circuit board includes a plurality of circuit layers and a composite material layer. A thermal conductivity of the composite material layer is between 450 W/mK and 700 W/mK. The heat generating element is disposed on the circuit board and electrically connected to the circuit layers. Heat generated by the heat generating element is transmitted to an external environment through the composite material layer.

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

Abstract: A package carrier includes a plurality of first circuit patterns, a plurality of second circuit patterns and an insulating material layer. The second circuit patterns are disposed between any two the first circuit patterns and are directly connected to the first circuit patterns. In a cross-sectional view, a first thickness of each of the first circuit patterns is greater than a second thickness of each of the second circuit patterns. A first surface of each of the first circuit patterns is aligned with a second surface of each of the second circuit patterns. The insulating material layer at least contacts the first circuit patterns.

Abstract: A lighting bulb according to embodiments of the disclosure comprises a light source assembly, a base and a transparent top cap. The light source assembly has a carrier plate, a first plurality of light-emitting units and a second plurality of light-emitting units. The carrier plate has first and second surfaces. The base is for fixing the carrier plate to have the first surface facing to a first direction and the second surface facing to a second direction opposite to the first direction. The transparent top cap has an inner surface facing to a third direction perpendicular to the first and second directions. The first and second plurality of light-emitting units are located between the transparent top cap and the base.

Abstract: A lighting bulb according to embodiments of the disclosure comprises a light source assembly, a base and a transparent top cap. The light source assembly has a carrier plate, a first plurality of light-emitting units and a second plurality of light-emitting units. The carrier plate has first and second surfaces. The base is for fixing the carrier plate to have the first surface facing to a first direction and the second surface facing to a second direction opposite to the first direction. The transparent top cap has an inner surface facing to a third direction perpendicular to the first and second directions. The first and second plurality of light-emitting units are located between the transparent top cap and the base.