Patents by Inventor Hsuan-Yu Chen
Hsuan-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).
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Patent number: 11973039Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.Type: GrantFiled: June 1, 2021Date of Patent: April 30, 2024Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia-Hao Sung, Hsuan-Yu Chen, Yu-Kai Lin
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Patent number: 11965237Abstract: A system and a method for detecting abnormality of a thin-film deposition process are provided. In the method, a thin-film is deposited on a substrate in a thin-film deposition chamber by using a target, a dimension of a collimator mounted between the target and the substrate is scanned by using at least one sensor disposed in the thin-film deposition chamber to derive an erosion profile of the target, and abnormality of the thin-film deposition process is detected by analyzing the erosion profile with an analysis model trained with data of a plurality of erosion profiles derived under a plurality of deposition conditions.Type: GrantFiled: November 13, 2020Date of Patent: April 23, 2024Assignee: Taiwan Semiconductor Manufacturing Company, Ltd.Inventors: Wen-Hao Cheng, Hsuan-Chih Chu, Yen-Yu Chen
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Patent number: 11655992Abstract: A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.Type: GrantFiled: February 13, 2018Date of Patent: May 23, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chun Hung Tsai, Hsuan Yu Chen
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Patent number: 11598625Abstract: An apparatus for deformation measurement and a method for deformation measurement are provided. The apparatus includes a housing, a sample holder, a moving mechanism, a first heating device and a second heating device. The sample holder is in the housing. The moving mechanism is over the sample holder. The first heating device is on the moving mechanism. The second heating device is below the sample holder.Type: GrantFiled: August 31, 2020Date of Patent: March 7, 2023Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Hsuan-Yu Chen, Ming-Han Wang
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Patent number: 11580944Abstract: A method for adjusting accompaniment music is disclosed. The method transposes the musical key of at least one section of the accompaniment music such that a song will have different musical key transpositions for different sections of the accompaniment music, so that singers whose vocal ranges are narrow can sing songs after the adjustment.Type: GrantFiled: December 9, 2020Date of Patent: February 14, 2023Inventors: Hsuan-Yu Chen, Chun-Lung Chen, I-Ting Lee, Kuan-Li Chao, Kuo-Wei Kao, Neo Bob Chih-Yung Young, Kuo-Ping Yang
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Patent number: 11375124Abstract: An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.Type: GrantFiled: February 25, 2019Date of Patent: June 28, 2022Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Ming-Han Wang, Ian Hu, Meng-Kai Shih, Hsuan Yu Chen
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Publication number: 20220065608Abstract: An apparatus for deformation measurement and a method for deformation measurement are provided. The apparatus includes a housing, a sample holder, a moving mechanism, a first heating device and a second heating device. The sample holder is in the housing. The moving mechanism is over the sample holder. The first heating device is on the moving mechanism. The second heating device is below the sample holder.Type: ApplicationFiled: August 31, 2020Publication date: March 3, 2022Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Hsuan-Yu CHEN, Ming-Han WANG
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Publication number: 20210288002Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.Type: ApplicationFiled: June 1, 2021Publication date: September 16, 2021Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia-Hao SUNG, Hsuan-Yu CHEN, Yu-Kai LIN
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Publication number: 20210241738Abstract: A method for adjusting accompaniment music is disclosed. The method transposes the musical key of at least one section of the accompaniment music such that a song will have different musical key transpositions for different sections of the accompaniment music, so that singers whose vocal ranges are narrow can sing songs after the adjustment.Type: ApplicationFiled: December 9, 2020Publication date: August 5, 2021Inventors: Hsuan-Yu CHEN, Chun-Lung CHEN, I-Ting LEE, Kuan-Li CHAO, Kuo-Wei KAO, Neo Bob Chih-Yung YOUNG, Kuo-Ping YANG
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Patent number: 11024586Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.Type: GrantFiled: January 22, 2019Date of Patent: June 1, 2021Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia-Hao Sung, Hsuan-Yu Chen, Yu-Kai Lin
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Patent number: 10861726Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.Type: GrantFiled: September 21, 2018Date of Patent: December 8, 2020Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chun Hung Tsai, Hsuan Yu Chen, Ian Hu, Meng-Kai Shih, Shin-Luh Tarng
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Publication number: 20200275030Abstract: An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.Type: ApplicationFiled: February 25, 2019Publication date: August 27, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Ming-Han WANG, Ian HU, Meng-Kai SHIH, Hsuan Yu CHEN
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Publication number: 20200235056Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.Type: ApplicationFiled: January 22, 2019Publication date: July 23, 2020Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.Inventors: Chia-Hao SUNG, Hsuan-Yu CHEN, Yu-Kai LIN
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Publication number: 20200098605Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.Type: ApplicationFiled: September 21, 2018Publication date: March 26, 2020Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun Hung TSAI, Hsuan Yu CHEN, Ian HU, Meng-Kai SHIH, Shin-Luh TARNG
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Publication number: 20190249891Abstract: A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.Type: ApplicationFiled: February 13, 2018Publication date: August 15, 2019Applicant: Advanced Semiconductor Engineering, Inc.Inventors: Chun Hung TSAI, Hsuan Yu CHEN
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Patent number: 10155993Abstract: Disclosed herein is a method of determining whether a subject having or is at risk of developing lung cancer. The presence of the SNP locus of rs193100333, which corresponds to a mutation on YAP1 protein with a substitution of an arginine to a tryptophan at position 331, indicates the subject has or is at risk of developing lung cancer. Accordingly, also disclosed herein is a kit for facilitating the detection of the SNP locus of rs193100333.Type: GrantFiled: September 22, 2016Date of Patent: December 18, 2018Assignee: National Taiwan UniversityInventors: Ker-Chau Li, Bing-Ching Ho, Sung-Liang Yu, Gee-Chen Chang, Hsuan-Yu Chen, Pan-Chyr Yang
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Patent number: 10111814Abstract: The present invention discloses a desensitizing toothpaste. Based on the total weight of the desensitizing toothpaste, the desensitizing toothpaste includes: from 5% to 40% by weight of DP-bioglass; from 1% to 5% by weight of thickening agents; from 25% to 35% by weight of humectant; and from 1% to 5% by weight of surfactant, wherein the DP-bioglass includes: 8.4% of Na2O, 40.6% of CaO, 39% of SiO2, and 12% of P2O5 based on the total weight of the DP-bioglass. With the implementation of the present invention, the indication of dentin hypersensitivity can be greatly relieved.Type: GrantFiled: June 20, 2013Date of Patent: October 30, 2018Assignee: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGYInventors: Feng-Huei Lin, Chun-Pin Lin, Chia-Ming Chang, Tzu-Piao Tang, Chung-King Hsu, Hsu-Wei Fang, Hsuan-Yu Chen
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Publication number: 20170081727Abstract: Disclosed herein is a method of determining whether a subject having or is at risk of developing lung cancer. The presence of the SNP locus of rs193100333, which corresponds to a mutation on YAP1 protein with a substitution of an arginine to a tryptophan at position 331, indicates the subject has or is at risk of developing lung cancer. Accordingly, also disclosed herein is a kit for facilitating the detection of the SNP locus of rs193100333.Type: ApplicationFiled: September 22, 2016Publication date: March 23, 2017Applicant: National Taiwan UniversityInventors: Ker-Chau LI, Bing-Ching HO, Sung-Liang YU, Gee-Chen CHANG, Hsuan-Yu CHEN, Pan-Chyr YANG
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Patent number: 8889106Abstract: A non-alcohol mouthwash composition without chemical antibacterial medicament is disclosed. The non-alcohol mouthwash composition includes from 0.03% to 1.5% of ?-polyglutamic acid (?-PGA) and from 0.5% to 4% of surfactant, all percentages based on the total weight of the mouthwash composition. The non-alcohol mouthwash composition preferably includes from 0.4% to 1.5% by weight, or more preferably from 0.8% to 1.3% by weight, of ?-PGA. Containing no chemical antibacterial medicament, the non-alcohol mouthwash composition can effectively inhibit bacterial growth in the oral cavity without irritating the oral mucosa.Type: GrantFiled: June 28, 2013Date of Patent: November 18, 2014Inventors: Feng-Huei Lin, Chun-Pin Lin, Hsuan-Yu Chen, Tzu-Piao Tang, Hsu-Wei Fang, Chung-King Hsu, Chia-Ming Chang
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Patent number: D730660Type: GrantFiled: October 29, 2013Date of Patent: June 2, 2015Assignee: Tair Jiuh Enterprise Co., Ltd.Inventors: I-Ming Chen, Hsuan-Yu Chen