Patents by Inventor Hsuan-Yu Chen

Hsuan-Yu Chen has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Publication number: 20240215907
    Abstract: In this invention, a novel wearable device is proposed for long-time measurement of user's spine posture and alignment. Mechanically, the device primarily comprises an actuation module, a measurement mechanism, and a processing module positioned on the wearing component. The measurement mechanism includes a primary measurement unit and at least one secondary measurement unit. These measurement units are interconnected in series, forming an underactuated mechanism, and are actuated by the actuation module. On each first primary/secondary rotational axis, at least one angular sensor is employed to measure the angle change relative to the adjacent measurement unit. The processing module is electrically connected to both the actuating module and at least one angular sensor, allowing it to receive angle change signals from the sensors and transmit a measurement signal from the wearable spinal measurement device.
    Type: Application
    Filed: December 13, 2023
    Publication date: July 4, 2024
    Inventors: TING-JEN YEH, MING-CHANG HSU, HSUAN-YU CHEN
  • Publication number: 20240159147
    Abstract: A performance monitoring system for a disc cutter of a tunnel boring machine (TBM) is provided, and includes a disc cutter body, a shaft assembly and an isolation boss; the shaft assembly includes a shaft main body and a bearing spacer located on the shaft main body; a rotating mechanism is arranged in a space between the isolation boss and the bearing spacer; the rotating mechanism includes a rotator and a T-shaped extension support located between the bearing spacer and the rotator; bearing retainers of roller bearings are arranged on two sides of the T-shaped extension support; a ring-shaped grating strip is arranged on one side of the rotator close to the T-shaped extension support; a connecting component is arranged on one side of the rotator away from a rotating bearing; and a sealing assembly is arranged between the T-shaped extension support and the rotator.
    Type: Application
    Filed: November 16, 2023
    Publication date: May 16, 2024
    Inventors: Nan-Kuang CHEN, Si-Chi CHEN, Hsuan-Yu CHEN, Wan-Shan TSAO
  • Patent number: 11978392
    Abstract: A precharge method for a data driver includes steps of: outputting a display data to a plurality of output terminals of the data driver; outputting a second precharge voltage to an output terminal among the plurality of output terminals prior to outputting the display data to the output terminal, to precharge the output terminal to a voltage level closer to an output voltage; and outputting a first precharge voltage to the output terminal prior to outputting the second precharge voltage. The first precharge voltage provides a faster voltage transition on the output terminal than the second precharge voltage.
    Type: Grant
    Filed: May 31, 2023
    Date of Patent: May 7, 2024
    Assignee: NOVATEK Microelectronics Corp.
    Inventors: Min-Yang Chiu, Yu-Sheng Ma, Jin-Yi Lin, Hsuan-Yu Chen, Jhih-Siou Cheng, Chun-Fu Lin
  • Patent number: 11973039
    Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.
    Type: Grant
    Filed: June 1, 2021
    Date of Patent: April 30, 2024
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Hao Sung, Hsuan-Yu Chen, Yu-Kai Lin
  • Patent number: 11655992
    Abstract: A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.
    Type: Grant
    Filed: February 13, 2018
    Date of Patent: May 23, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chun Hung Tsai, Hsuan Yu Chen
  • Patent number: 11598625
    Abstract: An apparatus for deformation measurement and a method for deformation measurement are provided. The apparatus includes a housing, a sample holder, a moving mechanism, a first heating device and a second heating device. The sample holder is in the housing. The moving mechanism is over the sample holder. The first heating device is on the moving mechanism. The second heating device is below the sample holder.
    Type: Grant
    Filed: August 31, 2020
    Date of Patent: March 7, 2023
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Hsuan-Yu Chen, Ming-Han Wang
  • Patent number: 11580944
    Abstract: A method for adjusting accompaniment music is disclosed. The method transposes the musical key of at least one section of the accompaniment music such that a song will have different musical key transpositions for different sections of the accompaniment music, so that singers whose vocal ranges are narrow can sing songs after the adjustment.
    Type: Grant
    Filed: December 9, 2020
    Date of Patent: February 14, 2023
    Inventors: Hsuan-Yu Chen, Chun-Lung Chen, I-Ting Lee, Kuan-Li Chao, Kuo-Wei Kao, Neo Bob Chih-Yung Young, Kuo-Ping Yang
  • Patent number: 11375124
    Abstract: An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.
    Type: Grant
    Filed: February 25, 2019
    Date of Patent: June 28, 2022
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Ming-Han Wang, Ian Hu, Meng-Kai Shih, Hsuan Yu Chen
  • Publication number: 20220065608
    Abstract: An apparatus for deformation measurement and a method for deformation measurement are provided. The apparatus includes a housing, a sample holder, a moving mechanism, a first heating device and a second heating device. The sample holder is in the housing. The moving mechanism is over the sample holder. The first heating device is on the moving mechanism. The second heating device is below the sample holder.
    Type: Application
    Filed: August 31, 2020
    Publication date: March 3, 2022
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Hsuan-Yu CHEN, Ming-Han WANG
  • Publication number: 20210288002
    Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.
    Type: Application
    Filed: June 1, 2021
    Publication date: September 16, 2021
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Hao SUNG, Hsuan-Yu CHEN, Yu-Kai LIN
  • Publication number: 20210241738
    Abstract: A method for adjusting accompaniment music is disclosed. The method transposes the musical key of at least one section of the accompaniment music such that a song will have different musical key transpositions for different sections of the accompaniment music, so that singers whose vocal ranges are narrow can sing songs after the adjustment.
    Type: Application
    Filed: December 9, 2020
    Publication date: August 5, 2021
    Inventors: Hsuan-Yu CHEN, Chun-Lung CHEN, I-Ting LEE, Kuan-Li CHAO, Kuo-Wei KAO, Neo Bob Chih-Yung YOUNG, Kuo-Ping YANG
  • Patent number: 11024586
    Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.
    Type: Grant
    Filed: January 22, 2019
    Date of Patent: June 1, 2021
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Hao Sung, Hsuan-Yu Chen, Yu-Kai Lin
  • Patent number: 10861726
    Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.
    Type: Grant
    Filed: September 21, 2018
    Date of Patent: December 8, 2020
    Assignee: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chun Hung Tsai, Hsuan Yu Chen, Ian Hu, Meng-Kai Shih, Shin-Luh Tarng
  • Publication number: 20200275030
    Abstract: An optical measurement equipment includes an adjustment apparatus and at least two image capturing devices. The image capturing devices have a depth-of-field and attached to the adjustment apparatus. The image capturing devices are adjusted by the adjustment apparatus such that a portion to be measured of a workpiece is located within the depth-of-field of the image capturing devices.
    Type: Application
    Filed: February 25, 2019
    Publication date: August 27, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Ming-Han WANG, Ian HU, Meng-Kai SHIH, Hsuan Yu CHEN
  • Publication number: 20200235056
    Abstract: A semiconductor device package includes a semiconductor die, a first conductive element, a second conductive element, a metal layer, and a first redistribution layer (RDL). The semiconductor die includes a first surface and a second surface opposite to the first surface. The first conductive element is disposed on the second surface of the semiconductor die. The second conductive element is disposed next to the semiconductor die. The metal layer is disposed on the second conductive element and electrically connected to the second conductive element. The first RDL is disposed on the metal layer and electrically connected to the metal layer.
    Type: Application
    Filed: January 22, 2019
    Publication date: July 23, 2020
    Applicant: ADVANCED SEMICONDUCTOR ENGINEERING, INC.
    Inventors: Chia-Hao SUNG, Hsuan-Yu CHEN, Yu-Kai LIN
  • Publication number: 20200098605
    Abstract: An apparatus includes: a first image capture module, a second image capture module, and a first projector. The first image capture module has a first optical axis forming an angle from approximately 70° to approximately 87° with respect to the surface of a carrier. The second image capture module has a first optical axis forming an angle of approximately 90° with respect to the surface of the carrier. The first projector has a first optical axis forming an angle from approximately 40° to approximately 85° with respect to the surface of the carrier.
    Type: Application
    Filed: September 21, 2018
    Publication date: March 26, 2020
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun Hung TSAI, Hsuan Yu CHEN, Ian HU, Meng-Kai SHIH, Shin-Luh TARNG
  • Publication number: 20190249891
    Abstract: A measuring system includes a temperature-variable container, an optical device and an air conditioner. The temperature-variable container includes a transparent plate. The optical device includes a first optical sensor unit and a second optical sensor unit. The air conditioner is disposed between the transparent plate and the optical device.
    Type: Application
    Filed: February 13, 2018
    Publication date: August 15, 2019
    Applicant: Advanced Semiconductor Engineering, Inc.
    Inventors: Chun Hung TSAI, Hsuan Yu CHEN
  • Patent number: 10155993
    Abstract: Disclosed herein is a method of determining whether a subject having or is at risk of developing lung cancer. The presence of the SNP locus of rs193100333, which corresponds to a mutation on YAP1 protein with a substitution of an arginine to a tryptophan at position 331, indicates the subject has or is at risk of developing lung cancer. Accordingly, also disclosed herein is a kit for facilitating the detection of the SNP locus of rs193100333.
    Type: Grant
    Filed: September 22, 2016
    Date of Patent: December 18, 2018
    Assignee: National Taiwan University
    Inventors: Ker-Chau Li, Bing-Ching Ho, Sung-Liang Yu, Gee-Chen Chang, Hsuan-Yu Chen, Pan-Chyr Yang
  • Patent number: 10111814
    Abstract: The present invention discloses a desensitizing toothpaste. Based on the total weight of the desensitizing toothpaste, the desensitizing toothpaste includes: from 5% to 40% by weight of DP-bioglass; from 1% to 5% by weight of thickening agents; from 25% to 35% by weight of humectant; and from 1% to 5% by weight of surfactant, wherein the DP-bioglass includes: 8.4% of Na2O, 40.6% of CaO, 39% of SiO2, and 12% of P2O5 based on the total weight of the DP-bioglass. With the implementation of the present invention, the indication of dentin hypersensitivity can be greatly relieved.
    Type: Grant
    Filed: June 20, 2013
    Date of Patent: October 30, 2018
    Assignee: NATIONAL TAIPEI UNIVERSITY OF TECHNOLOGY
    Inventors: Feng-Huei Lin, Chun-Pin Lin, Chia-Ming Chang, Tzu-Piao Tang, Chung-King Hsu, Hsu-Wei Fang, Hsuan-Yu Chen
  • Publication number: 20170081727
    Abstract: Disclosed herein is a method of determining whether a subject having or is at risk of developing lung cancer. The presence of the SNP locus of rs193100333, which corresponds to a mutation on YAP1 protein with a substitution of an arginine to a tryptophan at position 331, indicates the subject has or is at risk of developing lung cancer. Accordingly, also disclosed herein is a kit for facilitating the detection of the SNP locus of rs193100333.
    Type: Application
    Filed: September 22, 2016
    Publication date: March 23, 2017
    Applicant: National Taiwan University
    Inventors: Ker-Chau LI, Bing-Ching HO, Sung-Liang YU, Gee-Chen CHANG, Hsuan-Yu CHEN, Pan-Chyr YANG