Patents by Inventor Hsuan Yu LU

Hsuan Yu LU has filed for patents to protect the following inventions. This listing includes patent applications that are pending as well as patents that have already been granted by the United States Patent and Trademark Office (USPTO).

  • Circuit Board Packaged with Die through Surface Mount Technology
    Publication number: 20120074558
    Abstract: A package of a circuit board and a die are packed through surface mount technology (SMT). The shortest circuit is formed with at a low cost. Thus, the package can work in high speed and high frequency applications.
    Type: Application
    Filed: March 7, 2011
    Publication date: March 29, 2012
    Applicant: MAO BANG ELECTRONIC CO., LTD.
    Inventors: Hsuan Yu LU, Tse Ming CHU, Kuei-Wu CHU